Conference Proceedings of the Society for Experimental Mechanics Series,1912-4465
GENERAL NOTES
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International conference proceedings
CONTENTS NOTE
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From the Contents: Warpage Measurement of Simulated Electronic Packaging Assembly -- Nanomechanical Characterization of Lead Free Solder Joints -- In-Situ Surface Mount Process Characterization Using Digital Image Correlation -- Acoustic Waveform Energy as an Interconnect Damage Indicator -- Shape Optimization of Cantilevered Piezoelectric Devices -- Unique Fabrication Method for Novel MEMS Micro-contact Structure -- A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms -- Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics
TOPICAL NAME USED AS SUBJECT
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Congresses ، Microelectromechanical systems
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Congresses ، Nanotechnology
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، Engineering
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، Nanotechnology and Microengineering
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، Theoretical and Applied Mechanics
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، Nanotechnology
DEWEY DECIMAL CLASSIFICATION
Number
621
.
381
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK7875
PERSONAL NAME - PRIMARY RESPONSIBILITY
Relator Code
AU
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Gordon Shaw III, Barton C. Prorok, LaVern Starman, Cosme Furlong, editors
AU nodroG ,wahS editor of compilation
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SE Conference proceedings of the Society for Experimental Mechanics series,
CORPORATE BODY NAME - SECONDARY RESPONSIBILITY
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Annual Conference on Experimental and Applied Mechanics)2013 :Lombard, Ill.(