عنوان
پدید آورنده
موضوع
رده
TK7875
TK7875
کتابخانه
محل استقرار
2147
MEMS and nanotechnology.proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics
1 online resource )viii, 134 pages( : illustrations
Conference Proceedings of the Society for Experimental Mechanics Series,1912-4465
International conference proceedings
From the Contents: Warpage Measurement of Simulated Electronic Packaging Assembly -- Nanomechanical Characterization of Lead Free Solder Joints -- In-Situ Surface Mount Process Characterization Using Digital Image Correlation -- Acoustic Waveform Energy as an Interconnect Damage Indicator -- Shape Optimization of Cantilevered Piezoelectric Devices -- Unique Fabrication Method for Novel MEMS Micro-contact Structure -- A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms -- Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics
Congresses ، Microelectromechanical systems
Congresses ، Nanotechnology
، Engineering
، Nanotechnology and Microengineering
، Theoretical and Applied Mechanics
، Nanotechnology
621
.
381
TK7875
AU
Gordon Shaw III, Barton C. Prorok, LaVern Starman, Cosme Furlong, editors
AU nodroG ,wahS editor of compilation
TI
SE
SE Conference proceedings of the Society for Experimental Mechanics series,
Annual Conference on Experimental and Applied Mechanics)2013 :Lombard, Ill.(
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