9781441977588 (hbk)
IR
EN-55628
انگلیسی
IR
Advanced materials for thermal management of electronic packaging
[Book]
/ Xingcun Colin Tong
New York ;London
: Springer,
, c2011.
xxi, 616 p. , ill. (some col.) , 25 cm.
(Springer series in advanced microelectronics,1437-0387
; 30)
Electronic
Includes bibliographical references and index.
Thermal management fundamentals and design guides in electronic packaging -- Characterization methodologies of thermal management materials -- Electronic packaging materials and their functions in thermal managements -- Monolithic carbonaceous materials and carbon matrix composites -- Thermally conductive polymer matrix composites -- HIgh thermal conductivity metal matrix composites -- Thermally conductive ceramic matrix composites -- Thermal interface materials in electronic packaging -- Materials and design for advanced heat spreader and air cooling heat sinks -- Liquid cooling devices and their materials selection -- Thermoelectric cooling through thermoelectric materials -- Development and application of advanced thermal management materials -- Standards and specifications for evaluation of thermal management in electronic industry.
Springer series in advanced microelectronics
30
Electronic apparatus and appliances, Temperature control
Electronic packaging, Materials
E-BOOK
Tong, Xingcun Colin.
ایران
9781441977588.pdf
عادی
عادی
9781441977588.pdf
متن
old catalog
e
BL
1
a
Y
