Advanced materials for thermal management of electronic packaging
General Material Designation
[Book]
First Statement of Responsibility
/ Xingcun Colin Tong
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
New York ;London
Name of Publisher, Distributor, etc.
: Springer,
Date of Publication, Distribution, etc.
, c2011.
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
xxi, 616 p. , ill. (some col.) , 25 cm.
SERIES
Series Title
(Springer series in advanced microelectronics,1437-0387
Volume Designation
; 30)
NOTES PERTAINING TO PUBLICATION, DISTRIBUTION, ETC.
Text of Note
Electronic
INTERNAL BIBLIOGRAPHIES/INDEXES NOTE
Text of Note
Includes bibliographical references and index.
CONTENTS NOTE
Text of Note
Thermal management fundamentals and design guides in electronic packaging -- Characterization methodologies of thermal management materials -- Electronic packaging materials and their functions in thermal managements -- Monolithic carbonaceous materials and carbon matrix composites -- Thermally conductive polymer matrix composites -- HIgh thermal conductivity metal matrix composites -- Thermally conductive ceramic matrix composites -- Thermal interface materials in electronic packaging -- Materials and design for advanced heat spreader and air cooling heat sinks -- Liquid cooling devices and their materials selection -- Thermoelectric cooling through thermoelectric materials -- Development and application of advanced thermal management materials -- Standards and specifications for evaluation of thermal management in electronic industry.
SERIES
Title
Springer series in advanced microelectronics
Volume Number
30
TOPICAL NAME USED AS SUBJECT
Electronic apparatus and appliances, Temperature control