1.
پدیدآورنده : Characeterization of integrated circuit packaging materials
کتابخانه: Central Library and Documents Center of Al-Zahra University (Tehran)
موضوع : ، Electronic packing- Materials,، Integrated circuits- Design and construction
رده :
TK
7870
.
15
.
C53
1993
2. Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack 95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Luhaina, Maui, Hawaii
پدیدآورنده : Sponsored by the Electrical and Electronic packaging Division, ASME, The Japan Society of Mechanical Engineers; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Electronic packaging - Congresses
رده :
TK
7870
.
15
.
I57
1995
3. Application of fracture mechanics in electronic packaging and materials : presented at the International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, Claifornia
پدیدآورنده : sponsored by the electrical and Electronic Packaging Division, ASME, The Materials Division, ASME ; edited by Tien Y. Wu ... ]et al.[
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Electronic packaging - Materials - Congresses , Materials - Electric properties - Congresses
رده :
TK
7870
.
15
.
A85
1995
4. Applications of experimental mechanics to electronic packaging -1997- : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
پدیدآورنده : sponsored by the Electrical and Electrnic Packaging Division, ASME, the Applied Mechanics Division, ASME; edited by J.C. Suhling, K.M. liechti, S. Liu
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Electronic packaging - Congresses , Mechanics, Applied - Congresses
رده :
TK
7870
.
15
.
A643
1997
5. Child-resistant packaging :a symposium
پدیدآورنده : sponsored by ASTM Subcommittee D-01.61 on Child-Resistant Packaging and Packaging Consistent with Poison Prevention Packaging Act of 0791 of ASTM Committee D-01 on Packaging, American Society for Testing and Materials, Philadelphia, Pa., 71-81 Sept. 5791
کتابخانه: Library of Razi Metallurgical Research Center (Tehran)
موضوع : Congresses ، Child-resistant packaging
رده :
TS
198
.
C46
S95
1976
6. Eleventh Annual IEEE semiconductor thermal measurement and management symposium, February 7-9, 1995, Red Lion Hotel San Jose, CA USA
پدیدآورنده : The Components, Packaging, & Manufacturing Technology )CHMT( Society, Symposium Sponsor, Institute of Electrical and Electronics Engineers
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Semiconductors - Thermal properties - COngresses , Semiconductors - Cooling - COngresses
رده :
TK
7871
.
85
.
I27
I33
1995
7. Engineering desing guide: VMEbus and DIN
پدیدآورنده : Eurocard Packaging, revision 5.0
کتابخانه: Central Library and Documents Center of Industrial University of Khaje Nasiredin Toosi (Tehran)
موضوع : ، VME )Computer bus(
رده :
TK
7895
.
B87E5
8. H.Point (<اچ. پوينت>) راهنماي طراحي خودرو
پدیدآورنده : / نوشته استوارت ميسي، جف واردل,عنوان اصلي: < H-point : the fundamentals of car design & packaging> واژه‌نامه نمايه <اچ. پوينت. راهنماي طراحي خودرو> ;
کتابخانه: Central Library and Archive Center of shahid Beheshti University (Tehran)
موضوع : اتومبيل‌ها -- طرح و ساختمان
رده :
۶۲۹
/
۲۳
م
۹۷۱
الف
۱۳۹۲
9. H.Point راهنمای طراحی خودرو
پدیدآورنده : / نوشته استوارت مکی، جف واردل,H-point : the fundamentals of car design & packaging .
کتابخانه: Central Library and Documents Center of Mazandaran University (Mazandaran)
موضوع : اتومبیل‌ها -- طرح و ساختمان
رده :
TL
۲۴۰
/
م
۹
الف
۳ ۱۳۹۲
10. H2O : water packaging design
پدیدآورنده : H two O, Water packaging design
کتابخانه: Campus International Library of Kish University of Tehran (Hormozgan)
موضوع : Commercial art,Arte comercial,Water bottles,Packaging -- Design
11. #ITHERM 2000
پدیدآورنده : #edited by Gary B. Kroman, J. Richard Culham, Koneru Ramakrishna, sponsored by The Components, Packaging, and Manufacturing Technology Society, ... and others
کتابخانه: Central Library of Esfehan University of Technology (Esfahan)
موضوع : Electronic apparatus and appliances- Thermal properties- Congresses ،Electronic apparatus and appliances- Design and construction - Congresses ،Heat- Transmission- Congresses
رده :
#
TK
،#.
I56
،#
2000
12. Microelectronics interconnection and packaging
پدیدآورنده : edited by jerry Lyman, editor Packaging & production, Electronics
کتابخانه: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
موضوع : ، Integrated circuits,، Microelectronic packaging
رده :
TK
7874
.
M483
13. Packaging of chemicals and other industrial liquids and solid
پدیدآورنده : [by]& C. Swinbank [for the Institute of Packaging
کتابخانه: Central Library of Ahvaz Faculty of Petroleum (Khuzestan)
موضوع : Chemicals- Packing
رده :
TP
,
201
,.
S87
,
1973
14. Performance testing of shipping containers
پدیدآورنده : sponsored by ASTM Committee D-01 on Packaging
کتابخانه: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
موضوع : Testing ، Containers
رده :
TS
195
.
8
.
P47
1985
15. Proceedings 1994 IEMT Symposium : Sixteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium September 12-14, 1994, La Jolla, CA, US
پدیدآورنده : Sponsored by the Electronic Industries Association, IEEE Components, Packaging, and Manufacturing Technology Society
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Electronic industries - Automation - Congresses , Electronic apparatus and appliances - Design and construction - Congresses , Electronic packaging - Congresses
رده :
TK
7836
.
I33
1994
16. 1994 Proceedings: sixth Annual IEEE International Conference on Wafer Scale Integration, San Francisco California, USA
پدیدآورنده : Sponsored by IEEE Computer Society, IEEE Components, Packaging, & Manufacturing Technology Society; edited by R. Mike Lea and Stuart Tewksbury
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Integrated circuits - Wafer-scale integration - Congresses
رده :
TK
7874
.
A56
1994
17. Sensing, modeling and simulation in emerging electronic packaging: presented at the 1996 ASME International Mechanical Engineering Congress and Exposition , November 17-22, 1996, Atlanta, Georgia
پدیدآورنده : sponsored by the Elctrical and Electronic Packaging Division, ASME ; edited by Chao-Pin Yeh, Charled Ume
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Electronic Packaging - Congresses , Multichip modules )Microelectronics( - Congresses
رده :
TK
7870
.
15
.
A852
1996
18. Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
پدیدآورنده : sponsored by the Manufacturing Engineering Division, ASME, The Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Electronic packaging - Congresses
رده :
TK
7870
.
15
.
A854
1995
19. Structural analysis in microelectronics and fiber optics 1994: presented at 1994 International Mechanical Engineering Congress and exposition, Chicago, Illinois, november 6-11,1994
پدیدآورنده : sponsored by the Electrical and Electronic Packaging Division ASME, edited by Ephraim Suhir
کتابخانه: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
موضوع : Microelectronics - Congresses,Fiber optics - Congresses,Congresses ، Structural analysis )Engineering(
رده :
TK
7874
.
A534
1994
20. Structural analysis in microelectronics and fiber optics, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
پدیدآورنده : sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Microelectronic packaging - Congresses , Fiber optics - Congresses , Structural analysis )Engineering( - Congresses
رده :
TK
7874
.
S84527
1997
