1. A Complete Course in Canning and Related Processes : Volume 2 Microbiology, Packaging, HACCP and Ingredients
Author: / Featherstone, Susan
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: ENGINEERING, CHEMICAL
Classification :
E-BOOK
2. A guide to thermoformed plastic packaging
Author: FARNHAM,STANLEY E
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: PLASTICS IN PACKAGING
Classification :
TS
198
.
3
.
P5
F37
3. A hand book for printing and packaging technology
Author: /Bishwanath Chakravarty
Library: National Library and Archives of Islamic Republic of Iran (Tehran)
Subject:
4. A handbook of food packaging
Author: Paine, Frank Albert
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Food Packaging
Classification :
TP
374
.
P35
1992
5. A handbook of food packaging
پدیدآورنده : Paine, Frank Albert
موضوع : $AFood$BPackaging
۲ نسخه از این کتاب در ۲ کتابخانه موجود است.
6. A handbook of food packaging
Author: Paine, Frank Albert.
Library: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
Subject: Packaging ، Food
Classification :
TP
374
.
P35
1983
7. A handbook of food packaging
Author: Paine, Frank A.
Library: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
Subject: Packaging ، Food
Classification :
TP
374
.
P35
1992
8. Active food packaging
Author:
Library: Central Library and Documents Center of Mazandaran University (Mazandaran)
Subject: Food ; Packaging. ;
9. Active food packaging
Author: / edited by M.L. Rooney
Library: Central Library and Document Center of Shahid Chamran University (Khuzestan)
Subject: Food--Packaging
Classification :
TP
,
374
,.
A37
,
1995
10. #Active packaging for food applications
Author: #Aaron L. Brody, Eugene R. Strupinsky, Lauri R. Kline
Library: Central Library of Esfehan University of Technology (Esfahan)
Subject: Food- Packaging
Classification :
#
TP
،#.
B75
11. Active packaging for food applications
Author: Brody, Aaron L.
Library: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
Subject: Packaging ، Food
Classification :
TP
374
.
B75
2001
12. Adhesive bonding in photonics assembly and packaging
Author: / B.G.Yacobi,M.Hubert
Library: Central Library and Document Center of Arak University (Markazi)
Subject: Photonics,Adhesive,Optoelectronic devices-design and construction
Classification :
621
.
3622
Y12a
13. Advanced Flip Chip Packaging
Author: \ Ho-Ming Tong, Yi-Shao Lai, C.P. Wong Editors
Library: Library of Foreign Languages and Islamic Sources (Qom)
Subject: Electronic packaging,نصب تجهیزات الکترونیکی,a02,a02,Flip chip technology.
Classification :
E-Book
,
14. Advanced Flip Chip Packaging
Author: / Shao Lai, C.P. Wong-Ming Tong, Yi-Ho
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: INSTRUMENTATION& ELECTRONIC|ENGINEERING, MULTIDISCIPLINARY|INSTRUMENTS &ENGINEERING, CIVIL|ENGINEERING, ELECTRICAL
Classification :
E-BOOK
15. Advanced MEMS packaging
Author: John H. Lau ... ]et al.[
Library: (Semnan)
Subject: ، Microelectromechanical systems,، Microelectronic packaging
Classification :
TK
7875
.
A378
2010
16. Advanced MEMS packaging
پدیدآورنده :
موضوع : ، Microelectromechanical systems,، Microelectronic packaging
۲ نسخه از این کتاب در ۲ کتابخانه موجود است.
17. Advanced MEMS packaging
Author: John H. Lau [and others].
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Microelectromechanical systems.,Microelectronic packaging.,TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
Classification :
TK7875
.
J646
2010
18. Advanced MEMS packaging
Author: / John H. Lau ... [et al.]
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: ELECTRONIC|ENGINEERING, MECHANICAL|ENGINEERING, TELECOMMUNICATIONS&ENGINEERING, ELECTRICAL
Classification :
E-BOOK
19. Advanced MEMS packaging /John H. Lau ... [et al.].
Author:
Library: Library of Campus2 Colleges of Engineering of Tehran University (Tehran)
Subject: Microelectromechanical systems.,Microelectronic packaging.
Classification :
TK
7875
.
A378
2010
20. Advanced Materials for Thermal Management of Electronic Packaging
Author: / Xingcun Colin Tong
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: INSTRUMENTATION& ELECTRONIC|INSTRUMENTS &ENGINEERING, ELECTRICAL
Classification :
E-BOOK
