661. Selling women's history : packaging feminism in twentieth-century American popular culture
Author: Emily Westkaemper
Library: (Library of Islamic Studies For Women and Family (Tehran (Tehran)
Subject: Feminism > United States > History ***** Women > United States > History ***** Women in advertising > United States > History ***** SOCIAL SCIENCE / Women's Studies ***** SOCIAL SCIENCE / Popular Culture ***** Women in popular culture > United States > History ***** History in popular culture > United States > History ***** History in advertising > United States > History ***** ART / Popular Culture ***** DESIGN / Graphic Arts / Advertising ***** HISTORY / United States / General *****
662. Semiconductor Packaging: Materials Interaction and Reliability
Author: / Yu Lo-Andrea Chen, Randy Hsiao
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: ELECTRONIC|ENGINEERING, MULTIDISCIPLINARY|MATERIALS SCIENCE (uncategorised)&ENGINEERING, ELECTRICAL
Classification :
E-BOOK
663. Semiconductor Packaging: Materials Interaction and Reliability
Author: / Chen, Andrea
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: ELECTRONIC|MATERIALS SCIENCE (uncategorised)&ENGINEERING, ELECTRICAL
Classification :
E-BOOK
664. Semiconductor advanced packaging
Author:
Library: Central Library and Documents Center of Mazandaran University (Mazandaran)
Subject: Semiconductors ;
665. Semiconductor packaging
Author: / Andrea Chen, Randy Hsiao-Yu Lo
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Microelectronic packaging.
Classification :
TK7870
.
15
.
C54
2011
666. Semiconductor packaging: a multidisciplinary approach
Author: edited by Robert J. Hannemann, Allan D. Kraus, Michael Pecht
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic packaging , Integrated circuits - Very large scale integration
Classification :
TK
7870
.
15
.
S46
1994
667. Semiconductor packaging: a multidisciplinary approach
Author: edited by: Robert j. Hannemann, Allan D. Kraus, Michael Pecht
Library: (Semnan)
Subject: ، Electronic packaging,، Integrated circuits- Very large scale integration
Classification :
TK
7870
.
15
.
P49
668. Seminar on the test requirements for packaging for the transport of radioactive materials, Vienna, February 1971 proceedings
Author:
Library: University of Tabriz Library, Documentation and Publication Center (East Azarbaijan)
Subject: Radioactive substances transportation
Classification :
HF5770
.
S5
669. Sending Agents to the Principal's Office: How Talent Agency Packaging and Producing Breach the Fiduciary Duties Agents Owe Their Artist-Clients
Author: Smith, Brian T.; et al.,Smith, Brian T.; et al.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject:
670. Sensing, modeling and simulation in emerging electronic packaging: presented at the 1996 ASME
Author: sponsored by the Elctrical and Electronic Packaging Division, ASME ; edited by Chao-Pin Yeh, Charled Ume
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic Packaging - Congresses , Multichip modules )Microelectronics( - Congresses
Classification :
TK
7870
.
15
.
A852
1996
671. Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering
Author: sponsored by the Manufacturing Engineering Division, ASME, The Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic packaging - Congresses
Classification :
TK
7870
.
15
.
A854
1995
672. Smart packaging technologies for fast moving consumer goods
Author: Kerry, Joseph.
Library: Library of Razi Metallurgical Research Center (Tehran)
Subject: ، Food, Preservation, Research,، Consumer goods, Packing, Research,، Radio frequency identification systems, Research,، Packaging machinery, Research,، Packaging, Research
Classification :
TP
371
.
2
.
K47
2008
673. Smart packaging technologies for fast moving consumer goods
Author: / Joseph Kerry, Paul Butler
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Food-Preservation- Research,Consumer goods- Packing- Research,Radio frequency identification systems- Research,Packaging machinery- Research,Packaging- Research
Classification :
TP371
.
2
.
K47
2008
674. Smoke 'em If You Got 'em: Discussing the WTO Dispute Settlement Panel's Decision to Uphold Plain Packaging in Australia and its Impact on the Future
Author: Kelly, Lucas G.,Kelly, Lucas G.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject:
675. Solar Module Packaging: Polymeric Requirements and Selection
Author: / Poliskie, Michelle
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: ELECTRONIC|ENGINEERING, MANUFACTURING|MATERIALS SCIENCE (uncategorised)& FUELS|ENGINEERING, ELECTRICAL &ENERGY
Classification :
E-BOOK
676. Solar module packaging :
Author: Michelle Poliskie.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Photovoltaic cells-- Design and construction.,Polymers-- Optical properties.,Solar cells-- Materials.
677. Solar module packaging
Author: Michelle Poliskie.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Photovoltaic cells-- Design and construction.,Polymers-- Optical properties.,Solar cells-- Materials.
678. Solder paste in electronics packaging
Author: / Jennie S.Hwang,Hwang
Library: Central Library and Documents Center of Tehran University (Tehran)
Subject: Printed circuits -- Design and construction,Solder pastes,surfacemount technology
Classification :
TK
7868
.
P7H82
1989
679. Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly
Author: Hwang, Jennie S.
Library: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
Subject: Design and construction ، Printed circuits,، Solder pastes,، Surface mount technology
Classification :
TK
7868
.
P7
H82
1989
680. Solder paste in electronics packaging :technology and applications in surface mount, hybrid circuits, and component assembly
Author: Jennie S. Hwang
Library: Central Library and Information Center of Shahed University (Tehran)
Subject: Printed circuits--Design and construction,Solder pastes,Surface mount technology
Classification :
TK
،
7868
،.
P7
,
H82
،
1989
