Systems-level packaging for millimeter-wave transceivers /
نام عام مواد
[Book]
نام نخستين پديدآور
Mladen Božanić, Saurabh Sinha.
وضعیت نشر و پخش و غیره
محل نشرو پخش و غیره
Cham, Switzerland :
نام ناشر، پخش کننده و غيره
Springer,
تاریخ نشرو بخش و غیره
[2019]
مشخصات ظاهری
نام خاص و کميت اثر
1 online resource
فروست
عنوان فروست
Smart sensors, measurement and instrumentation ;
مشخصه جلد
volume 34
یادداشتهای مربوط به کتابنامه ، واژه نامه و نمایه های داخل اثر
متن يادداشت
Includes bibliographical references.
یادداشتهای مربوط به مندرجات
متن يادداشت
Intro; Preface; Contents; About the Authors; 1 Research Impact of System-Level Packaging for Millimeter-Wave Transceivers; 1.1 Significance of Device Packaging at Millimeter-Wave Range and Systems Approach; 1.2 Research Contextualization: A Modern Communication System; 1.2.1 Transmitter; 1.2.2 Transmitting and Receiving Antennas; 1.2.3 The Receiver; 1.2.4 Example of State-of-the-Art Transceiver; 1.3 Other Considerations: Substrates, Active Devices and Passives; 1.4 Practical Research Focus: Applications of Millimeter-Wave Systems
متن يادداشت
1.5 Identifying Research Gaps: Packaging Techniques and Technologies1.5.1 Traditional Approach-A One-Chip Solution; 1.5.2 A Two-Chip Solution; 1.5.3 Packaging Multiple Dice; 1.5.4 The Ultimate Goal: System Optimization Through Improved Packaging; 1.5.5 The Packaging Decision; 1.6 Research Questions: Packaging for Millimeter-Wave Applications; 1.7 Contribution to the Body of Knowledge; 1.8 Content Overview; References; 2 Millimeter-Wave Research Challenges; 2.1 Wavelength Significance; 2.2 The Millimeter-Wave Part of the Spectrum; 2.3 Propagation of Millimeter Waves
متن يادداشت
2.4 Antennas for Millimeter-Waves2.4.1 General Antenna Theory; 2.4.2 Millimeter-Wave Antennas; 2.5 Millimeter-Wave Considerations; 2.5.1 Losses; 2.5.2 Uncertainty; 2.5.3 Feasibility of Component Values; 2.5.4 Interconnects and Component Sizing; 2.5.5 Coupling and Shielding; 2.5.6 Layout Dependency; 2.5.7 Bonding; 2.5.8 Package Leads; 2.5.9 Concluding Remarks; References; 3 Behavior of Active and Passive Devices at Millimeter-Wave Frequencies; 3.1 Solid-State Active Devices; 3.1.1 Metal-Oxide Transistors; 3.1.2 MOSFET Operation at Millimeter Wave Frequencies; 3.1.3 Bipolar Transistors
متن يادداشت
3.1.4 HBT Operation at Millimeter Wave Frequencies3.1.5 Noise Figure in HBTs and MOSFETs; 3.2 Transmission Lines; 3.2.1 Q-Factors of Passive Devices; 3.2.2 Introduction to Transmission Lines; 3.2.3 Types of Transmission Lines; 3.2.4 General Transmission Line; 3.2.5 The Quarter-Wave Transformer; 3.2.6 Substrate Integrated Waveguides; 3.2.7 Slow Co-planar Waveguides; 3.3 Resistors; 3.4 Capacitors; 3.4.1 Parallel-Plate Capacitors; 3.4.2 Transmission-Line Capacitors; 3.4.3 Other Capacitors; 3.5 Inductors; 3.5.1 Wound Inductors; 3.5.2 Integrated Inductors; 3.5.3 Embedded Inductors
متن يادداشت
3.5.4 Bond Wires3.5.5 Transmission-Line Inductors; 3.5.6 RF Chokes; 3.6 Transformers and Baluns; 3.7 Concluding Remarks; References; 4 Integrated Substrates: Millimeter-Wave Transistor Technologies; 4.1 Means for Comparison of Technologies; 4.2 CMOS Technology; 4.2.1 Important Characteristics; 4.2.2 State-of-the-Art CMOS Technologies; 4.3 High-Electron Mobility Transistor Technology; 4.3.1 Important Characteristics; 4.3.2 State-of-the-Art High-Electron Mobility Technologies; 4.4 Heterojunction Bipolar Transistor Technology; 4.4.1 Important Characteristics
بدون عنوان
0
بدون عنوان
8
بدون عنوان
8
بدون عنوان
8
بدون عنوان
8
یادداشتهای مربوط به خلاصه یا چکیده
متن يادداشت
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
یادداشتهای مربوط به سفارشات
منبع سفارش / آدرس اشتراک
Springer Nature
شماره انبار
com.springer.onix.9783030146900
ویراست دیگر از اثر در قالب دیگر رسانه
عنوان
Systems-level packaging for millimeter-wave transceivers.
شماره استاندارد بين المللي کتاب و موسيقي
9783030146894
موضوع (اسم عام یاعبارت اسمی عام)
موضوع مستند نشده
Gigabit communications-- Equipment and supplies.
موضوع مستند نشده
Millimeter wave communication systems.
موضوع مستند نشده
Millimeter wave communication systems.
موضوع مستند نشده
TECHNOLOGY & ENGINEERING-- Mechanical.
مقوله موضوعی
موضوع مستند نشده
TEC-- 009070
موضوع مستند نشده
TJKW
موضوع مستند نشده
TJKW
رده بندی ديویی
شماره
621
.
384
ويراست
23
رده بندی کنگره
شماره رده
TK5103
.
4835
نشانه اثر
.
B69
2019
نام شخص به منزله سر شناسه - (مسئولیت معنوی درجه اول )