1.
المؤلف: Characeterization of integrated circuit packaging materials
المکتبة: كتابخانه مركزي و مركز اسناد دانشگاه الزهراء (س) (طهران)
موضوع: ، Electronic packing- Materials,، Integrated circuits- Design and construction
رده :
TK
7870
.
15
.
C53
1993
2. Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack 95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Luhaina, Maui, Hawaii
المؤلف: Sponsored by the Electrical and Electronic packaging Division, ASME, The Japan Society of Mechanical Engineers; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama
المکتبة: (طهران)
موضوع: Electronic packaging - Congresses
رده :
TK
7870
.
15
.
I57
1995
3. Application of fracture mechanics in electronic packaging and materials : presented at the International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, Claifornia
المؤلف: sponsored by the electrical and Electronic Packaging Division, ASME, The Materials Division, ASME ; edited by Tien Y. Wu ... ]et al.[
المکتبة: (طهران)
موضوع: Electronic packaging - Materials - Congresses , Materials - Electric properties - Congresses
رده :
TK
7870
.
15
.
A85
1995
4. Applications of experimental mechanics to electronic packaging -1997- : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
المؤلف: sponsored by the Electrical and Electrnic Packaging Division, ASME, the Applied Mechanics Division, ASME; edited by J.C. Suhling, K.M. liechti, S. Liu
المکتبة: (طهران)
موضوع: Electronic packaging - Congresses , Mechanics, Applied - Congresses
رده :
TK
7870
.
15
.
A643
1997
5. CAE/CAD and thermal management issues in electronic systems
المؤلف: / Sponsord by the electrical and electronic packaging division, ASME, edited by Derje Agonafer [et. al.]
المکتبة: مكتبات الكلية التقنية بجامعة طهران (طهران)
موضوع: Electronic apparatus and appliances - Temmpreture control - Congresses,Electronic packaging - Design - Data processing - Congresses,Heat-Tranmission--Data processing - Congresses,Heat sinks (Electronics) - Congresses,Computer - aided engineering - Congresses
رده :
TK
7870
.
25
.
C34
1997
6. CAE/CAD and thermal management issues in electronic systems
المؤلف: / Sponsord by the electrical and electronic packaging division, ASME, edited by Derje Agonafer [et. al.]
المکتبة: مكتبات الكلية التقنية 1 بجامعة طهران (طهران)
موضوع: Electronic apparatus and appliances - Temmpreture control - Congresses,Electronic packaging - Design - Data processing - Congresses,Heat-Tranmission--Data processing - Congresses,Heat sinks (Electronics) - Congresses,Computer - aided engineering - Congresses
رده :
TK
7870
.
25
.
C34
1997
7. Child-resistant packaging :a symposium
المؤلف: sponsored by ASTM Subcommittee D-01.61 on Child-Resistant Packaging and Packaging Consistent with Poison Prevention Packaging Act of 0791 of ASTM Committee D-01 on Packaging, American Society for Testing and Materials, Philadelphia, Pa., 71-81 Sept. 5791
المکتبة: کتابخانه مرکز پژوهش متالورژی رازی (طهران)
موضوع: Congresses ، Child-resistant packaging
رده :
TS
198
.
C46
S95
1976
8. Eleventh Annual IEEE semiconductor thermal measurement and management symposium, February 7-9, 1995, Red Lion Hotel San Jose, CA USA
المؤلف: The Components, Packaging, & Manufacturing Technology )CHMT( Society, Symposium Sponsor, Institute of Electrical and Electronics Engineers
المکتبة: (طهران)
موضوع: Semiconductors - Thermal properties - COngresses , Semiconductors - Cooling - COngresses
رده :
TK
7871
.
85
.
I27
I33
1995
9. Engineering desing guide: VMEbus and DIN
المؤلف: Eurocard Packaging, revision 5.0
المکتبة: كتابخانه مركزي و مركز اسناد دانشگاه صنعتي خواجه نصير الدين طوسى (طهران)
موضوع: ، VME )Computer bus(
رده :
TK
7895
.
B87E5
10. H.Point (<اچ. پوينت>) راهنماي طراحي خودرو
المؤلف: / نوشته استوارت ميسي، جف واردل,عنوان اصلي: < H-point : the fundamentals of car design & packaging> واژه‌نامه نمايه <اچ. پوينت. راهنماي طراحي خودرو> ;
المکتبة: المكتبة المركزية ومركز الأرشيف (طهران)
موضوع: اتومبيل‌ها -- طرح و ساختمان
رده :
۶۲۹
/
۲۳
م
۹۷۱
الف
۱۳۹۲
11. H.Point راهنمای طراحی خودرو
المؤلف: / نوشته استوارت مکی، جف واردل,H-point : the fundamentals of car design & packaging .
المکتبة: كتابخانه مركزي و مركز اسناد دانشگاه مازندران (مازندران)
موضوع: اتومبیل‌ها -- طرح و ساختمان
رده :
TL
۲۴۰
/
م
۹
الف
۳ ۱۳۹۲
12. H2O
المؤلف: / H two O, Water packaging design
المکتبة: مكتبة حرم كيش الدولي بجامعة طهران (هرمزکان)
موضوع: Commercial art,Arte comercial,Water bottles,Packaging -- Design
رده :
NC
997
.
H8
2010
13. #ITHERM 2000
المؤلف: #edited by Gary B. Kroman, J. Richard Culham, Koneru Ramakrishna, sponsored by The Components, Packaging, and Manufacturing Technology Society, ... and others
المکتبة: کتابخانه مرکزی دانشگاه صنعتی اصفهان (أصبهان)
موضوع: Electronic apparatus and appliances- Thermal properties- Congresses ،Electronic apparatus and appliances- Design and construction - Congresses ،Heat- Transmission- Congresses
رده :
#
TK
،#.
I56
،#
2000
14. Microelectronics interconnection and packaging
المؤلف: edited by jerry Lyman, editor Packaging & production, Electronics
المکتبة: کتابخانه مرکزی و مرکز اطلاع رسانی دانشگاه فردوسی مشهد (خراسان رضوی)
موضوع: ، Integrated circuits,، Microelectronic packaging
رده :
TK
7874
.
M483
15. Packaging of chemicals and other industrial liquids and solid
المؤلف: [by]& C. Swinbank [for the Institute of Packaging
المکتبة: كتابخانه مركزي دانشكده نفت اهواز (خوزستان)
موضوع: Chemicals- Packing
رده :
TP
,
201
,.
S87
,
1973
16. Performance testing of shipping containers
المؤلف: sponsored by ASTM Committee D-01 on Packaging
المکتبة: کتابخانه مرکزی و مرکز اطلاع رسانی دانشگاه فردوسی مشهد (خراسان رضوی)
موضوع: Testing ، Containers
رده :
TS
195
.
8
.
P47
1985
17. Proceedings 1994 IEMT Symposium : Sixteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium September 12-14, 1994, La Jolla, CA, US
المؤلف: Sponsored by the Electronic Industries Association, IEEE Components, Packaging, and Manufacturing Technology Society
المکتبة: (طهران)
موضوع: Electronic industries - Automation - Congresses , Electronic apparatus and appliances - Design and construction - Congresses , Electronic packaging - Congresses
رده :
TK
7836
.
I33
1994
18. 1994 Proceedings: sixth Annual IEEE International Conference on Wafer Scale Integration, San Francisco California, USA
المؤلف: Sponsored by IEEE Computer Society, IEEE Components, Packaging, & Manufacturing Technology Society; edited by R. Mike Lea and Stuart Tewksbury
المکتبة: (طهران)
موضوع: Integrated circuits - Wafer-scale integration - Congresses
رده :
TK
7874
.
A56
1994
19. Sensing, modeling and simulation in emerging electronic packaging: presented at the 1996 ASME International Mechanical Engineering Congress and Exposition , November 17-22, 1996, Atlanta, Georgia
المؤلف: sponsored by the Elctrical and Electronic Packaging Division, ASME ; edited by Chao-Pin Yeh, Charled Ume
المکتبة: (طهران)
موضوع: Electronic Packaging - Congresses , Multichip modules )Microelectronics( - Congresses
رده :
TK
7870
.
15
.
A852
1996
20. Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
المؤلف: sponsored by the Manufacturing Engineering Division, ASME, The Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh
المکتبة: (طهران)
موضوع: Electronic packaging - Congresses
رده :
TK
7870
.
15
.
A854
1995
