Reliability and failure of electronic materials and devices /
نام عام مواد
[Book]
نام نخستين پديدآور
Milton Ohring, Lucian Kasprzak
وضعیت ویراست
وضعيت ويراست
Second edition
مشخصات ظاهری
نام خاص و کميت اثر
1 online resource
يادداشت کلی
متن يادداشت
Includes index
متن يادداشت
Machine generated contents note: CH 1 An Overview of Electronic Devices and Their Reliability CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated CH 3 Defects, Contamination and Yield CH 4 The Mathematics of Failure and Reliability CH 5 Mass Transport-Induced Failure Ch 6 Electronic Charge-Induced Damage CH 7 Environmental Damage to Electronic Products CH 8 Packaging Materials, Processes, and Stresses CH 9 Degradation of Contacts and Packages CH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and Devices CH 11 Characterization and Failure Analysis of Material, Devices and Packages CH 12 Future Directions and Reliability Issues
یادداشتهای مربوط به کتابنامه ، واژه نامه و نمایه های داخل اثر
متن يادداشت
Includes bibliographical references and index
یادداشتهای مربوط به مندرجات
متن يادداشت
FrontCover; FM-CTR-01; DEDICATION; CONTENTS; Chapter 11 -- Characterization and Failure Analysis of Materials and Devices; PREFACE TO THE FIRST EDITION; 1.1 ELECTRONIC PRODUCTS; 1.3 FAILURE PHYSICS; 1.4 SUMMARY AND PERSPECTIVE; REFERENCES; 2.7 GAAS DEVICES; 2.8 ELECTRO-OPTICAL DEVICES; 2.9 PROCESSING-THE CHIP LEVEL; 2.10 MICROELECTROMECHANICAL SYSTEMS; EXERCISES; REFERENCES; 4.8 EPILOGUE-FINAL COMMENT; EXERCISES; REFERENCES; 5.2 DIFFUSION AND ATOM MOVEMENTS IN SOLIDS; 6.2 ASPECTS OF CONDUCTION IN INSULATORS; 7.2 ATMOSPHERIC CONTAMINATION AND MOISTURE; 8.5 THERMAL STRESSES IN PACKAGE STRUCTURES
متن يادداشت
9.2 the nature of contacts11.2 nondestructive examination and decapsulation; 12.2 integrated circuit technology trends; acronyms
بدون عنوان
0
بدون عنوان
8
یادداشتهای مربوط به خلاصه یا چکیده
متن يادداشت
"Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices"--
یادداشتهای مربوط به سفارشات
منبع سفارش / آدرس اشتراک
Safari Books Online
شماره انبار
CL0500000508
ویراست دیگر از اثر در قالب دیگر رسانه
عنوان
Reliability and failure of electronic materials and devices.
شماره استاندارد بين المللي کتاب و موسيقي
9780120885749
موضوع (اسم عام یاعبارت اسمی عام)
موضوع مستند نشده
Electronic apparatus and appliances-- Reliability
موضوع مستند نشده
System failures (Engineering)
رده بندی کنگره
شماره رده
TK7870
.
23
نشانه اثر
.
O37
2014eb
نام شخص به منزله سر شناسه - (مسئولیت معنوی درجه اول )