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Chemical mechanical planarization of microelectronic materials
پدید آورنده
موضوع
Microelectronics ; Materials. ; Grinding and polishing. ; Chemical mechanical planarization. ;
رده
کتابخانه
Central Library and Documents Center of Mazandaran University
محل استقرار
استان:
Mazandaran
ـ شهر:
Babolsar
تماس با کتابخانه :
62
-
35302861
-
011
NATIONAL BIBLIOGRAPHY NUMBER
Number
oldebook40927
LANGUAGE OF THE ITEM
.Language of Text, Soundtrack etc
eng
TITLE AND STATEMENT OF RESPONSIBILITY
Title Proper
Chemical mechanical planarization of microelectronic materials
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
New York :
Name of Publisher, Distributor, etc.
: J. Wiley,
Date of Publication, Distribution, etc.
, 1997.
NOTES PERTAINING TO PUBLICATION, DISTRIBUTION, ETC.
Text of Note
Print
TOPICAL NAME USED AS SUBJECT
Microelectronics ; Materials. ; Grinding and polishing. ; Chemical mechanical planarization. ;
PERSONAL NAME - PRIMARY RESPONSIBILITY
Steigerwald, Joseph M. ; Murarka, S. P. ; Gutmann, Ronald J. ;
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