عنوان

Advanced packaging and manufacturing technology based on adhesion engineering :

(Number (ISBN

3319778722

(Number (ISBN

9783319778723

Erroneous ISBN

3319778714

Erroneous ISBN

9783319778716

Title Proper

Advanced packaging and manufacturing technology based on adhesion engineering :

General Material Designation

[Book]

Other Title Information

wafer-level transfer packaging and fabrication techniques using interface energy control method /

First Statement of Responsibility

by Seonho Seok.

Place of Publication, Distribution, etc.

Cham :

Name of Publisher, Distributor, etc.

Springer International Publishing,

Date of Publication, Distribution, etc.

[2018]

Specific Material Designation and Extent of Item

1 online resource (viii, 115 pages) :

Other Physical Details

106 illustrations

Series Title

Springer Series in Advanced Manufacturing,

ISSN of Series

1860-5168

Text of Note

Includes bibliographical references.

Text of Note

Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies.

0

Text of Note

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) ( -MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

Title

Advanced packaging and manufacturing technology based on adhesion engineering.

International Standard Book Number

9783319778716

Microelectromechanical systems.

Microelectronic packaging.

Coatings.

Corrosion and anti-corrosives.

Engineering.

Machinery.

Manufacturing industries.

Materials science.

Nanotechnology.

TECHNOLOGY & ENGINEERING-- Mechanical.

Tools.

Tribology.

TEC-- 009070

TGXT

Number

Edition

Class number

Class number

Book number

Book number

Seok, Seonho

Date of Transaction

20200823112647.0

Cataloguing Rules (Descriptive Conventions))

pn

Electronic name

[Book]

Y