Modular Low-Power, High-Speed CMOS Analog-to-Digital Converter for Embedded Systems
General Material Designation
[Book]
First Statement of Responsibility
by Keh-La Lin, Armin Kemna, Bedrich J. Hosticka.
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Boston, MA
Name of Publisher, Distributor, etc.
Springer US
Date of Publication, Distribution, etc.
2003
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
(XXVI, 254 pages)
SERIES
Series Title
International series in engineering and computer science, 722.
CONTENTS NOTE
Text of Note
Analog-to-Digital Conversion --; Components for CMOS Folding and Interpolating A/D Converters --; Architecture and Design of CMOS Folding and Interpolating A/D Converters --; Physical Design of Low-Power, High-Speed Embedded CMOS A/D Converter --; Evaluation and Measurements --; General Conclusions and Outlook.
SUMMARY OR ABSTRACT
Text of Note
One of the main trends of microelectronics is toward design for integrated systems, i.e., system-on-a-chip (SoC) or system-on-silicon (SoS). Due to this development, design techniques for mixed-signal circuits become more important than before. Among other devices, analog-to-digital and digital-to-analog converters are the two bridges between the analog and the digital worlds. Besides, low-power design technique is one of the main issues for embedded systems, especially for hand-held applications. Modular Low-Power, High-Speed CMOS Analog-to-Digital Converter for Embedded Systems aims at design techniques for low-power, high-speed analog-to-digital converter processed by the standard CMOS technology. Additionally this book covers physical integration issues of A/D converter integrated in SoC, i.e., substrate crosstalk and reference voltage network design.