عنوان

Plastics for Electronics

(Number (ISBN

9400949421

(Number (ISBN

9401086907

(Number (ISBN

9789400949423

(Number (ISBN

9789401086905

Number

b593446

Title Proper

Plastics for Electronics

General Material Designation

[Book]

First Statement of Responsibility

edited by Martin T. Goosey.

Place of Publication, Distribution, etc.

Dordrecht

Name of Publisher, Distributor, etc.

Springer Netherlands

Date of Publication, Distribution, etc.

1985

Specific Material Designation and Extent of Item

(380 pages)

Text of Note

1. Introduction to Plastics and their Important Properties for Electronic Applications --; 2. Fundamental Properties of Polymers for Electronic Applications --; 3. Silicone Protective Encapsulants and Coatings for Electronic Components and Circuits --; 4. Epoxide Resins and their Formulation --; 5. Plastic Encapsulation of Semiconductors by Transfer Moulding --; 6. Plastic Encapsulated Device Reliability --; 7. Polymers for Semiconductor Processing --; 8. Plastics for Telecommunications --; 9. Plastics for Printed Wiring Substrates --; 10. Other Materials and their Applications in Electronics --; Appendix. Examples of Commercially Available Materials Trade Names and Manufacturers.

Text of Note

Much of the progress towards ever greater miniaturisation made by the electronics industry, from the early days of valves to the development of the transistor and later the integrated circuit, has only been made possible because of the availability of various polymeric materials. Indeed, many new plastics have been developed specifically for electri cal and electronic device applications and as a consequence the plastics and electronics industries have continued to grow side-by-side. Electronic components are one of the few groups of products in which the real cost performance function has declined significantly over the years, and part of the reason can be directly attributed to the availability and performance of new polymeric materials. The evolu tion of the personal computer is a specific example, where improve ments in polymer-based photoresists and plastic encapsulation techni ques have allowed the mass production of high-density memories and microprocessors at a cost which yields machines more powerful than mainframe computers of 30 years ago for little more than the price of a toy. Today, plastic materials are widely used throughout all areas of electrical and electronic device production in diverse applications ranging from alpha particle barriers on memory devices to insulator mouldings for the largest bushings and transformers. Plastics, or more correctly polymers, find use as packaging materials for individual microcircuits, protective coatings, wire and cable insulators, printed circuit board components, die attach adhesives, equipment casings and a host of other applications.

Physics.

Class number

Book number

edited by Martin T. Goosey.

Martin T Goosey

Electronic name

[Book]

Y