Preface"; "Contributors"; "Table of Contents"; "1 INTRODUCTION"; "2 SILICIDES AND CONTACTS FOR ULSI"; "3 ALUMINUM BASED MULTILEVEL METALLIZATIONS IN VLSI/ULSICs"; "4 INORGANIC DIELECTRICS"; "5 ORGANIC DIELECTRICS IN MULTILEVEL METALLIZATION OF INTEGRATED CIRCUITS"; "6 PLANARIZATION TECHNIQUES"; "7 LITHOGRAPHY AND ETCH ISSUES FOR A MULTILEVEL METALLIZATION SYSTEM"; "8 ELECTRO- AND STRESS MIGRATION IN MLM INTERCONNECT STRUCTURES"; "9 MULTILEVEL METALLIZATION TEST VEHICLE"; "10 MANUFACTURING AND ANALYTIC METHODS" "11 characterization techniques for vlsi multilevel metallization""12 electronic packaging and its influences on integrated circuit design and processing"; "13 future interconnect systems"; "index"
SUMMARY OR ABSTRACT
Text of Note
Covers various aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. This book also covers substrate characterization, adhesion, cleaning and processing.
TOPICAL NAME USED AS SUBJECT
Physical vapor deposition -- Handbooks, manuals, etc.