عنوان

Copper wire bonding /

(Number (ISBN

1461457610 (electronic bk.)

(Number (ISBN

9781461457619 (electronic bk.)

Erroneous ISBN

9781461457602

Number

b431174

Title Proper

Copper wire bonding /

General Material Designation

[Book]

First Statement of Responsibility

Preeti S. Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht

Specific Material Designation and Extent of Item

1 online resource (xxvi, 235 pages) :

Other Physical Details

illustrations

Text of Note

Includes bibliographical references and index

Text of Note

Copper Wire Bonding -- Bonding Process -- Bonding Metallurgies -- Wire Bond Evaluation -- Thermal Reliability Tests -- Humidity and Electromigration Tests -- Wire Bond Pads -- Concerns and Solutions -- Recommendations -- Appendix A: Reliability Data -- Appendix B: Patents on Copper Wire Bonding

0

Text of Note

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry

Copper wire

Wire bonding (Electronic packaging)

Engineering

Optical and Electronic Materials

TDPB

TEC-- 009070

TEC008070

TEC009070

Number

Edition

Class number

Chauhan, Preeti S.

Choubey, Anupam

Pecht, Michael

Zhong, ZhaoWei

Ohio Library and Information Network

Date of Transaction

20150609113936.0

Cataloguing Rules (Descriptive Conventions))

pn

Electronic name

[Book]

Y