عنوان

Polymers for high technology :

(Number (ISBN

0841214069

(Number (ISBN

9780841214064

Number

b428504

Title Proper

Polymers for high technology :

General Material Designation

[Book]

Other Title Information

electronics and photonics : developed from a symposium sponsored by the Division of Polymeric Materials--Science and Engineering at the 192nd Meeting of the American Chemical Society, Anaheim, California, September 7-12, 1986 /

First Statement of Responsibility

Murrae J. Bowden, editor, S. Richard Turner, editor

Specific Material Designation and Extent of Item

x, 628 pages :

Other Physical Details

illustrations ;

Dimensions

24 cm

Series Title

ACS symposium series,

Volume Designation

346

ISSN of Series

0097-6156 ;

Text of Note

Includes bibliographical references and indexes

Text of Note

Development of radiation chemistry / G. Arthur Salmon -- Primary action of ionizing radiation on condensed systems / J.K. Thomas and G. Beck -- Historical outline of radiation effects in polymers / Adolphe Chapiro -- Main reactions of chlorine- and silicon-containing electron and deep-UV (excimer laser) negative resists / Seiichi Tagawa -- Relations between photochemistry and radiation chemistry of polymers / J.E. Guillet -- Characteristics of a two-layer resist system using silicone-based negative resist for electron-beam lithography / Toshiaki Tamamura and Akinobu Tanaka -- Phenolic resin-based negative electron-beam resists / H. Shiraishi, N. Hayashi, T. Ueno, O. Suga, F. Murai, and S. Nonogaki -- Electron-beam sensitivity of cross-linked acrylate resists / Nigel R. Farrar and Geraint Owen -- A "one-layer" multilayer resist / R.D. Allen, S.A. MacDonald, and C.G. Willson -- New silicon-containing electron-beam resist systems / E. Reichmanis, A.E. Novembre, R.G. Tarascon, and A. Shugard -- Lithographic evaluation of poly(methyl methacrylate)-graft-poly(dimethylsiloxane) copolymers / Murrae J. Bowden, A.S. Gozdz, C. Klausner, J.E. McGrath, and S. Smith -- Acid-catalyzed thermolytic depolymerization of polycarbonates : a new approach to dry-developing resist materials / J.M.J. Fréchet, E. Eichler, M. Stanciulescu, T. Iizawa, F. Bouchard, F.M. Houlihan, and C.G. Willson -- Sensitivity of polymer blends to synchrotron radiation / J.A. Jubinsky, R.J. Groele, F. Rodriguez, Y.M.N. Namasté, and S.K. Obendorf -- A new high-sensitivity, water-developable negative photoresist / Anders Hult, Otto Skolling, Sven Göthe, and Ulla Mellström -- Soluble polysilanes in photolithography / R.D. Miller, D. Hofer, J. Rabolt, R. Sooriyakumaran, C.G. Willson, G.N. Fickes, J.E. Guillet, and J. Moore -- Evaluation of water-soluble diazonium salts as contrast-enhancement materials using a g-line stepper / S.-I. Uchino, T. Ueno, T. Iwayanagi, H. Morishita, S. Nonogaki, S.-I. Shirai, and N. Moriuchi -- Thermally stable, deep-UV resist materials / S. Richard Turner, K.D. Ahn, and C.G. Willson -- A silicon-containing positive photoresist developable with aqueous alkaline solution / N. Hayashi, T. Ueno, H. Shiraishi, T. Nishida, M. Toriumi, and S. Nonogaki -- Intensity dependence in polymer photochemistry / James R. Sheats and John S. Hargreaves -- Effects of additives on positive photoresist development / R.C. Daly, T. DoMinh, R.A. Arcus, and M.J. Hanrahan -- Importance of the interface condition upon photoresist image adhesion in microelectronic device fabrication / J.N. Helbert and N.C. Saha -- Polymer processing to thin films for microelectronic applications / Samson A. Jenekhe -- Stress-dependent solvent removal in poly(amic acid) coatings / C.L. Bauer and R.J. Farris -- Adhesion and yield of polyacrylate-based photoresist lamination in printed-circuit fabrication : influence of substrate thickness and preheat treatment / Eric S.W. Kong -- Simulation of resist profiles for 0.5-[micrometre] photolithography at 248 nm / R.K. Watts, T.M. Wolf, L.E. Stillwagon, and M.Y. Hellman -- Inorganic resist for bilayer applications / Akira Yoshikawa and Yasushi Utsugi -- Enhancement of dry-etch resistance of poly(butene-1 sulfone) / William M. Mansfield -- Degradation and passivation of poly(alkenylsilane sulfone)s in oxygen plasmas / A.S. Gozdz, D. Dijkkamp, R. Schubert, X.D. Wu, C. Klausner, and Murrae J. Bowden -- A single-layer, multilevel resist : limited-penetration electron-beam lithography / S.A. MacDonald, L.A. Pederson, A.M. Patlach, and C.G. Willson -- Oxygen ion etching resistance of organosilicon polymers / H. Gokan, Y. Saotome, K. Saigo, F. Watanabe, and Y. Ohnishi -- Nonlinear excitations and nonlinear phenomena in conductive polymers / A.J. Heeger, D. Moses, and M. Sinclair -- Dipolar alignment for second harmonic generation : host-guest inclusion compounds / David F. Eaton, Albert G. Anderson, Wilson Tam, and Ying Wang -- Polymers for integrated optics / John E. Sohn, Kenneth D. Singer, and Mark G. Kuzyk -- Polymer materials for optical fiber coating / L.L. Blyler, Jr., F.V. DiMarcello, A.C. Hart, and R.G. Huff -- Oriented polymers obtained by UV polymerization of oriented low molecular weight species / D.J. Broer and G.N. Mol -- Polyimides in microelectronics / Stephen D. Senturia -- Soluble aromatic polyimides for film and coating applications / Anne K. St. Clair and Terry L. St. Clair -- Cocyclotrimerization of aryl acetylenes : substituent effects on reaction rate / Daniel J. Dawson, Janice D. Frazier, Phillip J. Brock, and Robert J. Twieg -- Photo-cross-linking and imidization of poly(amic acid) methacrylate esters / H. Ahne, W.-D. Domke, R. Rubner, and M. Schreyer -- Polyimides as interlayer dielectrics for high-performance interconnections of integrated circuits / Ronald J. Jensen -- Preparation of polyimide mono- and multilayer films / Masa-aki Kakimoto, Masa-aki Suzuki, Yoshio Imai, Mitsumasa Iwamoto, and Taro Hino -- Prediction of lay-up consolidation during the lamination of epoxy prepregs / H.M. Tong and A.S. Sangani -- Effect of room-temperature-vulcanized silicone cure in device packaging / Ching-Ping Wong -- Evolution of epoxy encapsulation compounds for integrated circuits : a user's perspective / H.J. Moltzan, G.A. Bednarz, and C.T. Baker -- Stress analysis of the silicon chip-plastic encapsulant interface / S. Oizumi, N. Imamura, H. Tabata, and H. Suzuki -- Patterning of fine via holes in polyimide by an oxygen reactive ion etching method / Hiroshi Suzuki, Hiroyoshi Sekine, Shigeru Koibuchi, Hidetaka Sato, and Daisuke Makino -- Electrochemical synthesis and characterization of new polyheterocycles / M. Aldissi and A.M. Nyitray -- Synthesis and electronic properties of poly(8-methyl-2,3-6,7-quinolino) and its intermediate / J.Z. Ruan and M.H. Litt -- From pyropolymers to low-dimensional graphites / S. Yoshimura, M. Murakami, and H. Yasujima -- Band-structure calculations on polymeric chains / William J. Welsh

0

Microelectronics-- Materials, Congresses

Microlithography-- Materials, Congresses

Photoresists, Congresses

Polymers, Congresses

Number

Edition

Class number

Book number

Bowden, M. J.,1943-

Turner, S. Richard,1942-

American Chemical Society., Division of Polymeric Materials: Science and Engineering

American Chemical Society., Meeting(192nd :1986 :, Anaheim, Calif.)

Date of Transaction

20160712050121.0

Electronic name

[Book]

Y