Rapid thermal processing for future semiconductor devises: Processings of the 2001 international conference on rapid Thermal processing for future semiconductor Devises )RTP 2001(, held at Ise-Shima. Mie, Japan, November 14-16, 2001
EDITION STATEMENT
Statement of Responsibility Relating to Edition
Edited by Hisashi Fukuda
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Amesterdam: Lodon
Name of Publisher, Distributor, etc.
Elsevier
Date of Publication, Distribution, etc.
2003
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
x, 150p
NOTES PERTAINING TO SUBJECT ACCESS
Text of Note
غیرمرجع
NOTE RELATING TO THE COPY IN HAND
Text of Note
0
TOPICAL NAME USED AS SUBJECT
Entry Element
Semiconductors -- Heat treatment -- Congresses
Entry Element
Rapid thermal processing -- Congresse
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK
Classification Record Number
7871
.
85
Book number
.
I57665
2001
PERSONAL NAME - PRIMARY RESPONSIBILITY
Entry Element
International Conference on Rapid Thermal Processing For Future Semiconductor Devises )2nd: 2001: Ise-Shima, Mie, Japan(