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The simulation of thermomechanically induced stress in plastic encapsulated IC packages
پدید آورنده
Kelly, Gerard
موضوع
، Microelectronic packaging,، Integrated circuits-- Materials-- Stress corrosion,، Electronic apparatus and appliances-- Plastic embedment,، Integrated circuits-- Materials-- Thermomechanical properties
رده
TK
7874
.
K413
1999
کتابخانه
Central Library of Sharif University of Technology
محل استقرار
استان:
Tehran
ـ شهر:
Tehran
تماس با کتابخانه :
66005817
-
021
OTHER STANDARD IDENTIFIER
Standard Number
126555
LANGUAGE OF THE ITEM
.Language of Text, Soundtrack etc
بهار۰۸
.Language of Text, Soundtrack etc
English
TITLE AND STATEMENT OF RESPONSIBILITY
General Material Designation
)80(
First Statement of Responsibility
Kelly, Gerard
Title Proper
The simulation of thermomechanically induced stress in plastic encapsulated IC packages
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Boston
Name of Publisher, Distributor, etc.
Kluwer Academic Publishers
Date of Publication, Distribution, etc.
1999
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
xix, 134 p.: ill.; 25 cm
GENERAL NOTES
Text of Note
Includes bibliographical references and index
TOPICAL NAME USED AS SUBJECT
Entry Element
، Microelectronic packaging
Entry Element
، Integrated circuits-- Materials-- Stress corrosion
Entry Element
، Electronic apparatus and appliances-- Plastic embedment
Entry Element
، Integrated circuits-- Materials-- Thermomechanical properties
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK
7874
.
K413
1999
PERSONAL NAME - PRIMARY RESPONSIBILITY
Relator Code
AU
Entry Element
Gerard Kelly
TI
LOCATION AND CALL NUMBER
Shelving Form of Title, Author, Author/Title
08
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