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Multilayer ceramic substrate-technology for VLSI package/multichip module
پدید آورنده
K.Otsuka
موضوع
Electronic ceramics,Electronic packaging--Materials,Intergrated circuts--Very large scale integration--Design and construction,Aluminum oxide
رده
کتابخانه
Library of Institute For Color Science and Technology
محل استقرار
استان:
Tehran
ـ شهر:
Tehran
تماس با کتابخانه :
22946834
-
021
INTERNATIONAL STANDARD BOOK NUMBER
Terms of Availability and/or Price
Translation of:Seramikku tas O haisen Kiban
Terms of Availability and/or Price
Includes bibliographical references and index
English Book
TITLE AND STATEMENT OF RESPONSIBILITY
Title Proper
Multilayer ceramic substrate-technology for VLSI package/multichip module
First Statement of Responsibility
K.Otsuka
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
London
Name of Publisher, Distributor, etc.
Elsevier applied science
Date of Publication, Distribution, etc.
1993
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
xiii,242 P.:ill
SERIES
Series Title
Ceramic research and development in Japan
UNIFORM TITLE
General Material Designation
Seramikku tas o haisen kiban.English
TOPICAL NAME USED AS SUBJECT
Entry Element
Electronic ceramics
Entry Element
Electronic packaging--Materials
Entry Element
Intergrated circuts--Very large scale integration--Design and construction
Entry Element
Aluminum oxide
PERSONAL NAME - PRIMARY RESPONSIBILITY
Entry Element
Otsuka,Kanji
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