Preface; Poly(amic acid)s and their ionic salt solutions: Synthesis, characterization and stability study; A new interpretation of the kinetic model for the imidization reaction of PMDA-ODA and BPDA-PDA poly(amic acid)s; Synthesis and characterization of new organosoluble poly(ether imide)s derived from various novel bis(ether anhydride)s; Synthesis of novel polyimides from dianhydrides with flexible side chains; Polyimides based on rhenium(I) diimine complexes; New highly phenylated bis(phthalic) and bis(naphthalic) anhydrides and polyimides therefrom
Comparison of polyimide film surface properties exposed to real and simulated space environments: Relevance of atomic oxygen effects to wettability in spaceDevelopment and optimization of a laser carbonized polyimide film as a sensor substrate for an all-polymer humidity sensor; Fluorinated copolyimides for microelectronics applications; Fabrication of thin-film transistors on polyimide films; Polyimide/polystyrene nanocomposite films as membranes for gas separation and precursors for polyimide nanofoams; Amine-quinone polyimides -- High temperature polymers that protect iron against corrosion
New photoalignable polyimides and their ability to control liquid-crystal alignmentProton conducting polyimides from novel sulfonated diamines; High-modulus poly(p-phenylenepyromellitimide) films obtained using a novel gel-drawing technique; Effect of structure on the thermal behaviour of bisitaconimide resins; 1-Amino-4,5-8-naphthalenetricarboxylic acid-1,8-lactam-4,5-imide-containing macrocycles: Synthesis, molecular modeling and polymerization; Synthesis of aromatic benzoxazole polymers for high T[sub(g)], low dielectric properties
Polybenzobisthiazoles -- Critical issues in their performance and propertiesElectrical breakdown and electrostatic phenomena in ultra-thin polyimide Langmuir-Blodgett films; Humid ageing of polyetherimide: Chemical and physical interactions with water; Transport of water in high T[sub(g)] polymers: A comparison between interacting and non-interacting systems; New developments in the adhesion promotion of electroless Ni or Cu films to polyimide substrates; Surface modification of polyimide to improve its adhesion to deposited copper layer
Study on the structure and adhesion of copper thin films on chemically modified polyimide surfacesChemical interaction of Fe, Ni and Au with poly(vinyl chloride) and poly(tetrafluoroethylene) during thermal evaporation and the effect of post-metallization X-ray irradiation studied by in situ X-ray; Plasma polymer adhesion promoters for metal-polymer systems; Metallized polyimide films with high reflectivity and electroconductivity; RF plasma etching of a polyimide film with oxygen mixed with nitrogen trifluoride
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This text documents the proceedings of a symposium, held in 2001, on polyimides and other high temperature polymers. The 32 papers are divided into two parts: ""Synthesis, Properties and Bulk Characterization""; and ""Surface Modification, Interfacial or Adhesion Aspects and Applications"".