عنوان

Advanced organics for electronic substrates and packages

1483133192

1483165612

9781483133195

9781483165615

b546461

Advanced organics for electronic substrates and packages

[Book]

research manager, Andrew E. Fletcher.

First edition

Oxford, England

Elsevier Advanced Technology

1992. ©1992

(231 pages)

Front Cover; Advanced Organics for Electronic Substrates and Packages; Copyright Page; Table of Contents; EXECUTIVE SUMMARY AND CONCLUSIONS; CHAPTER 1. INTRODUCTION; 1.1 History and Developments in Electronic Devices; 1.2 Packaging Developments; 1.3 Conclusions; 1.4 Future Developments; 1.5 Development Projects and Initiatives; 1.6 Quality assurance; 1.7 Standards; 1.8 Environment; CHAPTER 2. MARKETS; CHAPTER 3. PRODUCTION; 3.1 Integrated Circuits (ICs); 3.2 Printed Circuit Boards (PCBs); 3.3 Encapsulation; 3.4 Packaging; CHAPTER 4. APPLICATIONS; 4.1 History and Background; 4.2 Packaging. 4.3 Polymers in Chip Fabrication (Level 0)4.4 Level 1 Packaging; 4.5 Package Types; 4.6 Multichip Module Packaging; 4.7 Thin Film Packaging; 4.8 Polymer Thick Film; 4.9 Level 2 Packaging; CHAPTER 5. MATERIALS; 5.1 Materials for Packages; 5.2 Thermoplastic and Thermoset Materials; 5.3 Interpenetrating Polymer Networks; 5.4 Material Properties and Requirements; 5.5 Thin Films; 5.6 Protective Gels; 5.7 Rigid Encapsulants; 5.8 PCB Laminates; 5.9 Materials Applications; 5.10 Environmental Considerations; 5.11 Properties of some Organic Packaging Materials; CHAPTER 6. THERMOSET POLYMERS. 6.1 Epoxies6.3 Methods of Production; 6.4 Resins; 6.5 Phenolic Resins; CHAPTER 7. THERMOPLASTIC COMPOUNDS; 7.1 Markets; 7.2 Material Properties; 7.3 Polyimides; 7.4 Polyurethanes; 7.5 Polyethers; 7.6 Polyesters; 7.7 Liquid Crystal Polymers; 7.8 Organosilicon Polymers; 7.9 Fluoropolymers; 7.10 Poly-(para-xylene); 7.11 Conductive Polymers; CHAPTER 8. SILICONES; CHAPTER 9. ACTIVITIES BY COMPANIES AND ORGANISATIONS; 9.1 North America; 9.2 Europe; 9.3 Japan; 9.4 Rest of the World.

Advanced Organics for Electronic Substrates and Packages.

Electronic packaging -- Materials.

TECHNOLOGY & ENGINEERING -- Mechanical.

research manager, Andrew E. Fletcher.

Andrew E Fletcher

[Book]

Y