عنوان
پدید آورنده
موضوع
رده
TK,7836,.H366,2010
TK
,
7836
,.
H366
,
2010
کتابخانه
محل استقرار
استان: أذربایجان الغربیة ـ شهر: أرومیة
9780071476232,0-07-147623-7
English Book
Wire bonding in microelectronics
George G. Harmon
3rd ed.
New York
McGraw-Hill,
2010
xx, 426 p. , ill.
Wire bonding (Electronic packaging), Production control
Electronic packaging, Reliability
Electronic packaging, Defects
Semiconductors, Failures
TK
,
7836
,.
H366
,
2010
Harman, George G.
Harman, George G.Reliability and yield problems of wire bonding in microelectronics.
Title
