یادداشتهای مربوط به کتابنامه ، واژه نامه و نمایه های داخل اثر
متن يادداشت
Includes bibliographical references and index.
یادداشتهای مربوط به مندرجات
متن يادداشت
Development and fabrication of IC chips -- Plastics, elastomers, and composites -- Ceramics and glasses -- Metals -- Solder technologies for electronic packaging and assembly -- Electroplating and deposited metallic coatings -- Printed circuit board fabrication -- Materials and processes for hybrid microelectronics and multichip modules -- Adhesives, underfills, and coatings in electronics assemblies -- Thermal management materials and systems.
بدون عنوان
0
یادداشتهای مربوط به خلاصه یا چکیده
متن يادداشت
"Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today's cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design."
یادداشتهای مربوط به سفارشات
منبع سفارش / آدرس اشتراک
Knovel Corporation
ویراست دیگر از اثر در قالب دیگر رسانه
عنوان
Electronic materials and processes handbook.
شماره استاندارد بين المللي کتاب و موسيقي
0071402144
موضوع (اسم عام یاعبارت اسمی عام)
موضوع مستند نشده
Electronic apparatus and appliances-- Materials, Handbooks, manuals, etc.