Place of publication: United States, Ann Arbor; ISBN=978-1-369-04368-6
یادداشتهای مربوط به پایان نامه ها
جزئيات پايان نامه و نوع درجه آن
M.S.
نظم درجات
Electrical and Computer Engineering
کسي که مدرک را اعطا کرده
University of Idaho
امتياز متن
2016
یادداشتهای مربوط به خلاصه یا چکیده
متن يادداشت
High speed, high densities and system-in-packages play an important role in microelectronics. Taking advantage of process technology improvements, semiconductor vendors are increasing device densities which increases demand on total current delivery. In this case, electrical integrity which includes signal integrity, power integrity and electromagnetic interference, is a major issue. Signal integrity assures acceptable quality of signals within the system, such as transmission line effects, cross talk, impedance mismatch. Power integrity assures acceptable quality of power delivery within the system, such as voltage drop, high impedance, parasitic via inductances, noise coupling are the most significant challenges for a semiconductor device designer. The increasingly rigorous noise requirements and timing issues require more predictive signal integrity and power integrity analysis to meet the market demand.
موضوع (اسم عام یاعبارت اسمی عام)
موضوع مستند نشده
Electrical engineering
اصطلاحهای موضوعی کنترل نشده
اصطلاح موضوعی
Applied sciences;Ansys HFSS;Differential S parameters;Power distribution network (PDN);Power integrity;Signal integrity;Z parameters
نام شخص به منزله سر شناسه - (مسئولیت معنوی درجه اول )