عنوان

Micro system technologies 90 :

شابک

3642456782

شابک

9783642456787

شماره

b568218

عنوان اصلي

Micro system technologies 90 :

نام عام مواد

[Book]

ساير اطلاعات عنواني

1st international conference on micro electro.

محل نشرو پخش و غیره

[Place of publication not identified]

نام ناشر، پخش کننده و غيره

Springer

تاریخ نشرو بخش و غیره

2014

متن يادداشت

integrated optics coherent receiver networks.- Wavelength division multiplexers for optical communication systems.- Pin photodiodes and field-effect transistors for monolithically integrated InP/lnGaAs optoelectronic circuits.- Semiconductor laser amplifiers as multifunctional devices.- Fiber optical amplifiers: technology and system applications.- Integrated optic Polarimetric refractometer.- Actuators.- Integrated fluid control systems on a silicon wafer (Invited Paper).- Micro liquid-handling devices - a review.- Electrically-activated, micromachined diaphragm valves.- An electrohydrodynamic injection pump - a novel actuator for microsystem technology.- Electrostatic and superconducting microactuators (Invited Paper).- Levitational bearing systems by meissner effect.- Rotational behaviour of living cells with reference to micro-motors.- Magnetically driven microactuators: design considerations.- Development of micro grippers.- Micro-actuator for micro-particles.- Author Index.

متن يادداشت

Simulation and Design.- Design of Micro Systems.- Microsystems: a challenge for CAD development (Plenary Talk).- A specification driven environment for microsystem design (Invited Paper).- Conceptual design of micro-electro-mechanical systems.- Intelligent CAD for micro mechanics.- CAD of Optical Devices.- Computer aided engineering for microsystems - status and trends (Plenary Talk).- Numerical simulation of optical devices.- CAD-tool for integrated optic coupling gratings.- Simulation on lateral detector - optical waveguide coupling.- Simulation and Design - Electrical and Thermal Properties.- Electrical connections through silicon wafer: application to 3D-multichip modules (Invited Paper).- Design methods for multichip systems (Invited Paper).- A fully-automatic macromodeling procedure for the electrical Simulation of integrated circuits.- KOSIM - a multi-level simulator for the design of integrated circuits.- Waveform estimation and hazard detection in digital MOS circuits.- Modelling of interconnects by boundary element method.- Thermal analysis of integrated circuits.- Sensitivity analysis in thermal wave measurement.- Simulation and Design of Sensors.- Design and simulation of sensors (Invited Paper).- Finite-element simulation of silicon accelerometers.- Accelerometer design considerations.- Measurement and Testing.- Testing.- Development of a thermal test chip.- Infrared microscopy - contactless temperature measurement on miniaturized electronic components.- Highly sensitive strain sensor for the qualification of epoxy compounds designed for the encapsulation of microsystems.- Material Characterization - Physical Properties.- Mechanical reliability of electronic devices.- Measurement of internal stress in thin silicon membranes.- Measurement of the thermal diffusivity of electrically nonconducting substrates.- Characterization of supersmooth surfaces with roughness below 0.1 nm.- Material Characterization - Semiconductor Characteristics.- Non-destructive testing of semiconductor materials using microwave photoconductivity.- Electrical characterization of III/V materials for heterostructure devices.- Material Characterization - Optical Methods.- Assessment of III-V epitaxial layers by optical methods.- Ellipsometry for process control in reaktive ion etching.- Thin film ellipsometric measurements - a tool for research and production.- High precision non-contacting metrology based on short coherence interferometry.- VIS-IR-ellipsometry for control and characterization of thin film processes.- Materials.- Materials for Packaging and Passivation.- Deposition, patterning, properties, and applications of AI2O3 films.- PECVD-passivation layers for printheads in micro-system-technology.- Hybrid integrated circuits on polycrystalline aluminium nitride.- High performance resin system for printed circuit boards.- Z-axis conductive, stress free, thermally conductive adhesive films and pastes for die- and component attach.- Integrated Optics Materials and Technologies.- Integrated optics in silicon.- Integrated optics on silicon with PECVD-fabricated waveguides.- Polymer waveguides in integrated optics.- Technologies.- Pattern Generation and Image Transfer.- Aspects of patterning inorganic-organic copolymers (ORMOCERs).- Photopattemable layers from amorphous, diamond-like carbon - an innovative material for microsystems technology.- Submicrometer photolithography by surface imaging - experiments and simulation.- X-ray imaging system.- Laser Supported Deposition.- Laser induced gold deposition on polyimide layers.- Selective pattern deposition of SnO2 thin film by laser pyrolysis.- Plane surface embedding technique for thin film hybrids.- Pulsed laser-plasma deposition of polycomponent thin-film structures - a review.- Laser-induced chemical vapour deposition of thin films in microelectronics.- Reactive Etching and Deposition.- Plasma-assisted etching (Invited Paper).- Reactive etching with ECR plasma source.- Production of resist masks by means of RIE.- Contact Methods.- A new explanation for the degradation of gold-aluminium bonds.- Simulation of the inner lead bonding process.- The application of an eutectic Gold-Tin cushion for TAB-inner lead bonding with reduced bonding pressure.- Bonding techniques on microsystem in cryogenics and microelectronic engineering.- Laser soldering of TAB inner lead bonds.- Packaging.- Solderable bumps for TAB and flip-chip bonding (Invited Paper).- Electroless bumping.- Hybridization of cooled mosaic sensors by indium-bumps.- Development of a fine pitch bumping process.- Tape automated bonding for high-density electronic packaging.- Adhesiveless copper-polyimide laminates for TAB's.- Optical Assembly and Interconnection Technologies.- Application of micromachining and micromechanics to components for optical communication (Invited Paper).- Thermal tunable minimized semiconductor laser-module.- Micro collimated light source using micro fresnel lens.- Monomode fused optical system elements.- Sensor and Actuator Technologies.- Sensor packaging (Invited Paper).- A method for thermal insulation of microstructures.- Machining of metal foils for use in microcompact heat exchangers.- Novel stress free assembly technique for micromechanical devices.- The LIGA process for microsystems (Invited Paper).- Movable microstructures manufactured by the LIGA process as basic elements for microsystems.- Ion beam techniques for micro electro mechanical systems (Invited Paper).- A novel mask compensation pattern for etched microstructures with several convex corners.- Wafer bonding and etchback techniques for silicon-on-insulator systems.- Basic Components and Applications.- Sensors for Physical Parameters.- Silicon microsystems as an industry (Invited Paper).- Micromachined silicon devices integrated with standard IC processes.- Design of an integrated humidity sensor with digital output in double metal CMOS technology.- CMOS compatible capacitive pressure sensor with read-out electronics.- Piezoresistive pressure sensors representing the 2nd generation avoid the physical limits based on conventional designs.- High performance miniaturized piezoresistive pressure transducers.- Fully integrated silicon pressure sensor with on-chip CMOS evaluation circuit and on-chip trimming.- Optimization of bipolar magneto-transistors.- Silicon RF power sensor from DC to microwave.- Self-testable accelerometer microsystem.- Micromechanical capacitive acceleration sensor with force compensation.- Capacitive accelerometer made by silicon micromechanics.- Micromechanical acceleration sensor.- CMOS readout electronics for capacitive acceleration sensors.- Gas and Ionic Sensors.- Development of basic structures for integrated chemical sensors for SO2 and NH3.- Technology and application of suspended gate field effect transistors for gas detection.- Preparation of TiO2 films for oxygen sensors.- Solid state chemical sensors in thick film technique.- Ionic sensor layers on microelectronic structures for the detection of solvent vapours.- An integrated ISFET-sensorarray with a CMOS signal-processing circuit.- CVD-Al2O3-layers: applicability in sensor devices.- Sensors for Biological and Medical Application.- Biochemical sensors for microsystems (Plenary Talk).- Miniaturised thin-film biosensors (Invited Paper).- Chip-biosensors - integration of bioactive components with transducers made in silicon technology.- Smart silicon system for a multi sensor catheter.- A digital output monolithic temperature sensor for invasive applications.- Optical Sensors.- New nanomechanical integrated optical devices as modulators, switches, and microphones; integrated optical (bio-)chemical sensors (Invited Paper).- High resolution interferometric displacement sensor using integrated optics in glass.- Integrated optical devices in LiNbO3 for sensors.- Optical Components.- Optoelectronic components and modules for multigigabit/s fibre optic transmission.- Elements for

شماره رده

نشانه اثر

نام الکترونيکي

نوع ماده

[Book]

تكميل شده

Y