عنوان

Copper wire bonding /

شابک

1461457610 (electronic bk.)

شابک

9781461457619 (electronic bk.)

شابک اشتباه

9781461457602

شماره

b431174

عنوان اصلي

Copper wire bonding /

نام عام مواد

[Book]

نام نخستين پديدآور

Preeti S. Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht

نام خاص و کميت اثر

1 online resource (xxvi, 235 pages) :

ساير جزييات

illustrations

متن يادداشت

Includes bibliographical references and index

متن يادداشت

Copper Wire Bonding -- Bonding Process -- Bonding Metallurgies -- Wire Bond Evaluation -- Thermal Reliability Tests -- Humidity and Electromigration Tests -- Wire Bond Pads -- Concerns and Solutions -- Recommendations -- Appendix A: Reliability Data -- Appendix B: Patents on Copper Wire Bonding

بدون عنوان

0

متن يادداشت

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry

موضوع مستند نشده

Copper wire

موضوع مستند نشده

Wire bonding (Electronic packaging)

موضوع مستند نشده

Engineering

موضوع مستند نشده

Optical and Electronic Materials

موضوع مستند نشده

TDPB

موضوع مستند نشده

TEC-- 009070

موضوع مستند نشده

TEC008070

موضوع مستند نشده

TEC009070

شماره

ويراست

شماره رده

مستند نام اشخاص تاييد نشده

Chauhan, Preeti S.

مستند نام اشخاص تاييد نشده

Choubey, Anupam

مستند نام اشخاص تاييد نشده

Pecht, Michael

مستند نام اشخاص تاييد نشده

Zhong, ZhaoWei

مستند نام تنالگان تاييد نشده

Ohio Library and Information Network

تاريخ عمليات

20150609113936.0

قواعد فهرست نويسي ( بخش توصيفي )

pn

نام الکترونيکي

نوع ماده

[Book]

تكميل شده

Y