عنوان

Soldering in electronics assembly /

شابک

008051734X

شابک

0750635452

شابک

128107134X

شابک

6611071342

شابک

9780080517346

شابک

9780750635455

شابک

9781281071347

شابک

9786611071349

شماره

b727631

عنوان اصلي

Soldering in electronics assembly /

نام عام مواد

[Book]

نام نخستين پديدآور

Mike Judd and Keith Brindley.

وضعيت ويراست

2nd ed.

محل نشرو پخش و غیره

Boston :

نام ناشر، پخش کننده و غيره

Newnes,

تاریخ نشرو بخش و غیره

1999.

نام خاص و کميت اثر

1 online resource (xi, 369 pages) :

ساير جزييات

illustrations

متن يادداشت

Includes bibliographical references (pages 313-316) and index.

متن يادداشت

Soldering process; Electronics assemblies; Solder; Flux; CS soldering processes; SC soldering processes; BGA technology; Cleaning of soldered assemblies; Avoiding problems -- soldering quality; Standards and specifications; Glossary; References; Worldwide addresses; Appendices: Why not blame the machine?, Problems and solutions, Soldering safety, Comparing soldering processes and machines; Index.

بدون عنوان

0

متن يادداشت

Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. Mike Judd is MD of Mike Judd Marketing and former MD of Electrovert UK, Director of Marketing Europe for Electrovert, part of the Cookson Group, and Director of OEM at Speedline. Keith Brindley is a technical author with a wealth of experience of all aspects of electronics technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment.

منبع سفارش / آدرس اشتراک

Elsevier Science & Technology

شماره انبار

95445:95444

عنوان

Soldering in electronics assembly.

شماره استاندارد بين المللي کتاب و موسيقي

9780750635455

موضوع مستند نشده

Printed circuits-- Design and construction.

موضوع مستند نشده

Solder and soldering.

موضوع مستند نشده

Elektronisches Bauelement

موضوع مستند نشده

Löten

موضوع مستند نشده

Printed circuits-- Design and construction.

موضوع مستند نشده

Solder and soldering.

موضوع مستند نشده

TECHNOLOGY & ENGINEERING-- Electronics-- Circuits-- General.

موضوع مستند نشده

TEC-- 008010

شماره

ويراست

شماره رده

نشانه اثر

شماره رده

شماره رده

شماره رده

شماره رده

شماره رده

شماره رده

کد سيستم

کد سيستم

کد سيستم

کد سيستم

کد سيستم

کد سيستم

مستند نام اشخاص تاييد نشده

Judd, Mike.

مستند نام اشخاص تاييد نشده

Brindley, Keith.

تاريخ عمليات

20201214005141.0

قواعد فهرست نويسي ( بخش توصيفي )

pn

نام الکترونيکي

نوع ماده

[Book]

تكميل شده

Y