عنوان

Advanced packaging and manufacturing technology based on adhesion engineering :

شابک

3319778722

شابک

9783319778723

شابک اشتباه

3319778714

شابک اشتباه

9783319778716

عنوان اصلي

Advanced packaging and manufacturing technology based on adhesion engineering :

نام عام مواد

[Book]

ساير اطلاعات عنواني

wafer-level transfer packaging and fabrication techniques using interface energy control method /

نام نخستين پديدآور

by Seonho Seok.

محل نشرو پخش و غیره

Cham :

نام ناشر، پخش کننده و غيره

Springer International Publishing,

تاریخ نشرو بخش و غیره

[2018]

نام خاص و کميت اثر

1 online resource (viii, 115 pages) :

ساير جزييات

106 illustrations

عنوان فروست

Springer Series in Advanced Manufacturing,

شاپا ي ISSN فروست

1860-5168

متن يادداشت

Includes bibliographical references.

متن يادداشت

Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies.

بدون عنوان

0

متن يادداشت

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) ( -MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

عنوان

Advanced packaging and manufacturing technology based on adhesion engineering.

شماره استاندارد بين المللي کتاب و موسيقي

9783319778716

موضوع مستند نشده

Microelectromechanical systems.

موضوع مستند نشده

Microelectronic packaging.

موضوع مستند نشده

Coatings.

موضوع مستند نشده

Corrosion and anti-corrosives.

موضوع مستند نشده

Engineering.

موضوع مستند نشده

Machinery.

موضوع مستند نشده

Manufacturing industries.

موضوع مستند نشده

Materials science.

موضوع مستند نشده

Nanotechnology.

موضوع مستند نشده

TECHNOLOGY & ENGINEERING-- Mechanical.

موضوع مستند نشده

Tools.

موضوع مستند نشده

Tribology.

موضوع مستند نشده

TEC-- 009070

موضوع مستند نشده

TGXT

شماره

ويراست

شماره رده

شماره رده

نشانه اثر

نشانه اثر

مستند نام اشخاص تاييد نشده

Seok, Seonho

تاريخ عمليات

20200823112647.0

قواعد فهرست نويسي ( بخش توصيفي )

pn

نام الکترونيکي

نوع ماده

[Book]

تكميل شده

Y