یادداشتهای مربوط به کتابنامه ، واژه نامه و نمایه های داخل اثر
متن يادداشت
Includes bibliographical references
یادداشتهای مربوط به مندرجات
متن يادداشت
Classic DfM: from 2D to 3D -- DfM at 28 nm and Beyond -- New DfM Domain: Stress Effects -- Conclusions and Future Work
بدون عنوان
0
یادداشتهای مربوط به خلاصه یا چکیده
متن يادداشت
This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package. Provides design for manufacturability guidelines on layout techniques for the most advanced, 22 nm technology nodes; Includes information valuable to layout designers, packaging engineers and quality engineers, working on memories, logic, system-on-chip and system-in-package; Offers a highly-accessible, single-source reference to information otherwise available only from disparate sources; Helps readers to translate reliability methodology into real design flows
ویراست دیگر از اثر در قالب دیگر رسانه
عنوان
Design for manufacturability
شماره استاندارد بين المللي کتاب و موسيقي
9781461417606
موضوع (اسم عام یاعبارت اسمی عام)
موضوع مستند نشده
Electronic circuit design.
موضوع مستند نشده
Integrated circuits-- Design.
مقوله موضوعی
موضوع مستند نشده
TEC-- 009070
رده بندی ديویی
شماره
621
.
3815
ويراست
23
رده بندی کنگره
شماره رده
TK7867
نام شخص به منزله سر شناسه - (مسئولیت معنوی درجه اول )