عنوان

Lead-free solders :

شابک

0470971827

شابک

1119966205 (electronic bk.)

شابک

9780470971826

شابک

9781119966203 (electronic bk.)

شماره

dltt

عنوان اصلي

Lead-free solders :

نام عام مواد

[Book]

ساير اطلاعات عنواني

materials reliability for electronics /

نام نخستين پديدآور

edited by K.N. Subramaniam.

نام خاص و کميت اثر

1 online resource

متن يادداشت

Includes bibliographical references and index

متن يادداشت

Access may be restricted to users at subscribing institutions

متن يادداشت

Front Matter -- Thematic Area I: Introduction. Reliability of Lead-Free Electronic Solder Interconnects: Roles of Material and Service Parameters / K N Subramanian -- Thematic Area II: Phase Diagrams and Alloying Concepts. Phase Diagrams and Their Applications in Pb-Free Soldering / Sinn-Wen Chen, Wojciech Gierlotka, Hsin-Jay Wu, Shih-Kang Lin -- Phase Diagrams and Alloy Development / Alan Dinsdale, Andy Watson, Ales Kroupa, Jan Vrestal, Adela Zemanova, Pavel Broz -- Interaction of Sn-Based Solders with Ni(P) Substrates: Phase Equilibria and Thermochemistry / Clemens Schmetterer, Rajesh Ganesan, Herbert Ipser -- Thematic Area III: Microalloying to Improve Reliability. 1Effects of Minor Alloying Additions on the Properties and Reliability of Pb-Free Solders and Joints2 / Sung K Kang -- Development and Characterization of Nano-Composite Solder / Johan Liu, Si Chen, Lilei Ye -- Thematic Area IV: Chemical Issues Affecting Reliability. Chemical Changes for Lead-Free Soldering and Their Effect on Reliability / Laura J Turbini -- Thematic Area V: Mechanical Issues Affecting Reliability. Influence of Microstructure on Creep and High Strain Rate Fracture of Sn-Ag-Based Solder Joints / P Kumar, Z Huang, I Dutta, G Subbarayan, R Mahajan -- Microstructure and Thermomechanical Behavior Pb-Free Solders / D R Frear -- Electromechanical Coupling in Sn-Rich Solder Interconnects / Q S Zhu, H Y Liu, L Zhang, Q L Zeng, Z G Wang, J K Shang -- Effect of Temperature-Dependent Deformation Characteristics on Thermomechanical Fatigue Reliability of Eutectic Sn-Ag Solder Joints / Andre Lee, Deep Choudhuri, K N Subramanian -- Thematic Area VI: Whisker Growth Issues Affecting Reliability. Sn Whiskers: Causes, Mechanisms and Mitigation Strategies / Nitin Jadhav, Eric Chason -- Tin Whiskers / Katsuaki Suganuma -- Thematic Area VII: Electromigration Issues Affecting Reliability. Electromigration Reliability of Pb-Free Solder Joints / Seung-Hyun Chae, Yiwei Wang, Paul S Ho -- Electromigration in Pb-Free Solder Joints in Electronic Packaging / Chih Chen, Shih-Wei Liang, Yuan-Wei Chang, Hsiang-Yao Hsiao, Jung Kyu Han, K N Tu -- Effects of Electromigration on Electronic Solder Joints / Sinn-Wen Chen, Chih-Ming Chen, Chao-Hong Wang, Chia-Ming Hsu -- Thematic Area VIII: Thermomigration Issues Affecting Reliability. Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints / Tian Tian, K N Tu, Hsiao-Yun Chen, Hsiang-Yao Hsiao, Chih Chen -- Thematic Area IX: Miniaturization Issues Affecting Reliability. Influence of Miniaturization on Mechanical Reliability of Lead-Free Solder Interconnects / Golta Khatibi, Herbert Ipser, Martin Lederer, Brigitte Weiss -- Index

بدون عنوان

0

منبع سفارش / آدرس اشتراک

Wiley InterScience

شماره انبار

10.1002/9781119966203

عنوان

Lead-free solders.

شماره استاندارد بين المللي کتاب و موسيقي

9780470971826

موضوع مستند نشده

Lead-free electronics manufacturing processes.

موضوع مستند نشده

Solder and soldering.

شماره

ويراست

شماره رده

نشانه اثر

مستند نام اشخاص تاييد نشده

Subramaniam, K. N.,Ph. D.

مستند نام تنالگان تاييد نشده

Ohio Library and Information Network.

مستند نام تنالگان تاييد نشده

Wiley Online Library (Online service)

تاريخ عمليات

20130111115854.0

قواعد فهرست نويسي ( بخش توصيفي )

rda

نام الکترونيکي

نوع ماده

[Book]

تكميل شده

Y