Design for manufacturability : from 1D to 4D for 90-22nm technology nodes
وضعیت نشر و پخش و غیره
محل نشرو پخش و غیره
New York
نام ناشر، پخش کننده و غيره
Springer
تاریخ نشرو بخش و غیره
2014
یادداشتهای مربوط به مسئولیت معنوی اثر
متن يادداشت
This book explains integrated circuit design for manufacturability )DfM( at the product level )packaging, applications( and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package. Provides design for manufacturability guidelines on layout techniques for the most advanced, 22 nm technology nodes; Includes information valuable to layout designers, packaging engineers and quality engineers, working on memories, logic, system-on-chip and system-in-package; Offers a highly-accessible, single-source reference to information otherwise available only from disparate sources; Helps readers to translate reliability methodology into real design flows.
موضوع (اسم عام یاعبارت اسمی عام)
عنصر شناسه ای
، Electronic circuit design
عنصر شناسه ای
، Integrated circuits -- Design
عنصر شناسه ای
، TECHNOLOGY & ENGINEERING / Mechanical
رده بندی کنگره
شماره رده
TK7874
نام شخص به منزله سر شناسه - (مسئولیت معنوی درجه اول )