21. Microscale heat transfer
Author: / edited by S. Kakac ... [et al.]
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Heat- Transmission Congresses,Electronic packaging Congresses,Microscale heat transfer
Classification :
E-BOOK
22. Microscale heat transfer
Author: / edited by S. Kakac ... [et al.]
Library: Central Library and Information Center of the University of Mohaghegh Ardabili (Ardabil)
Subject: Heat- Transmission Congresses,Electronic packaging Congresses,Microscale heat transfer
Classification :
QC320
.
M54
2005
23. Microscale heat transfer: fundamentals and applications
Author: edited by S. Kakac...]et al.[
Library: Central Library and Documents Center of Industrial University of Khaje Nasiredin Toosi (Tehran)
Subject: Congresses ، Heat - Transmission,Congresses ، Electronic packaging
Classification :
QC
320
.
M54
2005b
24. Microscale heat transfer: fundamentals and applications
Author: edited by S. Kakac...]et al.[
Library: Central Library and Documents Center of Industrial University of Khaje Nasiredin Toosi (Tehran)
Subject: Congresses ، Heat - Transmission,Congresses ، Electronic packaging
Classification :
QC
320
.
M54
25. New technology electronic packaging
Author: / edited by B. R. Livesay and M. D. Nagarkar
Library: Central Library and Documents Center of Tehran University (Tehran)
Subject: Electronic Packaging -- Congresses,Microelectronic packaging -- Congresses,Microelectronics -- Corrosion -- Congresses
Classification :
TK
7870
.
15
.
I57
1990
26. Polymeric materials for electronics packaging and interconnection :
Author: John H. Lupinski, editor, Robert S. Moore, editor.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic packaging-- Materials, Congresses.,Polymers, Congresses.
Classification :
TK7870
.
P654
1989
27. Polymeric materials for electronics packaging and interconnection
Author: John H. Lupinski, editor, Robert S. Moore, editor
Library: Central Library and Documents Center of Industrial University of Khaje Nasiredin Toosi (Tehran)
Subject: ، Electronic packaging -- Materials -- Congresses,، Polymers -- Congresses
Classification :
TK
7870
.
P654
28. Polymeric materials for electronics packaging and interconnection
Author: John H. Lupinski, editor, Robert S. Moore, editor
Library: Library of College of Science University of Tehran (Tehran)
Subject: Materials -- Congresses ، Electronic packaging,Congresses ، Polymers
Classification :
TK
7870
.
P654
1989
29. #Polymeric materials for electronics packaging and interconnection
Author: #John H. Lupinski, editor, Robert S. Moore, editor
Library: Central Library of Esfehan University of Technology (Esfahan)
Subject: Electronic packaging- Materials- Congresses ،Polymers- Congresses
Classification :
#
TK
،#.
P654
30. Polymeric materials for electronics packaging and interconnection
Author: John H. Lupinski, editor, Robert S. Moore, editor
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic packaging - Materials - Congresses , Polymers - Congresses
Classification :
TK
7870
.
P654
1988
31. Sensing, modeling and simulation in emerging electronic packaging: presented at the 1996 ASME International Mechanical Engineering Congress and Exposition , November 17-22, 1996, Atlanta, Georgia
Author: sponsored by the Elctrical and Electronic Packaging Division, ASME ; edited by Chao-Pin Yeh, Charled Ume
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic Packaging - Congresses , Multichip modules )Microelectronics( - Congresses
Classification :
TK
7870
.
15
.
A852
1996
32. Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
Author: sponsored by the Manufacturing Engineering Division, ASME, The Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic packaging - Congresses
Classification :
TK
7870
.
15
.
A854
1995
