181. Desk-top data bank:adhesives,anaerobic,contact,cyanoacrylate,film
Author: HOWARD,MICHAEL J ED
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: POLYMERS & POLYMERIZATION , ADHESIVES
Classification :
TP
156
.
P6
D51
1980
182. Desk-top data bank:specifications for adhesives,adhesives & glues
Author: HOWARD,MICHAEL J ED
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: POLYMERS & POLYMERIZATION , ADHESIVES-SPECIFICATIONS , GLUE-SPECIFICATIONS
Classification :
TP
156
.
P6
D47
1979
183. Developments in adhesives
Author: WAKE,WILLIAM CHARLES, ED
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: ADHESIVES
Classification :
TP
968
.
D45
184. Developments in pressure-sensitive products
Author: edited by Istvan Benedek
Library: Library of Razi Metallurgical Research Center (Tehran)
Subject: ، Pressure-sensitive adhesives,، Adhesives
Classification :
TP
971
.
D48
2006
185. Developments in pressure-sensitive products
Author: / edited by Istvaan Benedek
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Pressure-sensitive adhesives.,Adhesives.
Classification :
TP971
.
D48
2006
186. Dictionary of paints, adhesives and sealants: German/English = Worterbuch Farben, Klebstoffe und dictungsmittel: Deutsch/English
Author: Welling, Manfred S.
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Paint - Dictionaries , Adhesives - Dictionaries , Sealing compounds - Dictionaries , German language - Dictionaries - English , English language - Dictionaries - German
Classification :
TP
934
.
3
.
W44
1995
187. Durability of adhesive joints
Author: a symposium presented at a meeting of Committee D-41 on Adhesives, American Society for Testing and Materials, Washington, D.C., Oct. 31, 5691
Library: Library of Razi Metallurgical Research Center (Tehran)
Subject: ، Adhesives,، Joints )Engineering(
Classification :
TP
968
.
A644
1966
188. Durability of building and construction sealants and adhesives
Author: Andreas T. Wolf, editor.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Adhesives-- Deterioration, Congresses.,Adhesives-- Testing, Congresses.,Building materials-- Testing, Congresses.,Sealing compounds-- Deterioration, Congresses.,Sealing compounds-- Testing, Congresses.
Classification :
TA418
.
36
.
D87
2006
189. Durability of building and construction sealants and adhesives.
Author: JAI guest editor, Andreas T. Wolf
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Adhesives-- Deterioration, Congresses,Adhesives-- Testing, Congresses,Building materials-- Testing, Congresses,Sealing compounds-- Deterioration, Congresses,Sealing compounds-- Testing, Congresses
Classification :
TA418
.
36
.
A78
2011
190. Durability of building and construction sealants and adhesives :
Author: JAI guest editor, Andreas T. Wolf.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Adhesives-- Deterioration, Congresses.,Adhesives-- Testing, Congresses.,Building materials-- Testing, Congresses.,Sealing compounds-- Deterioration, Congresses.,Sealing compounds-- Testing, Congresses.
Classification :
TA403
.
A545
no
.
1514
191. Durability of strucutral adhesives
Author: KINLOCH,A J ED
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: ADHESIVES-ADDRESSES,ESSAYS,LECTURES
Classification :
TP
968
.
D87
192. Electrical Conductive Adhesives with Nanotechnologies
Author: / Yi Li, Daniel Lu, C. P. Wong
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Adhesives,Electronic packaging.,Nanostructured materials.,Solder and soldering.
Classification :
TK7870
.
15
.
L5
2010
193. Electrical conductive adhesives with nanotechnologies
Author: / Yi Li, Daniel Lu, C.P. Wong
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Electronic packaging,Solder and soldering,Adhesives, Electric properties,Nanostructured materials
Classification :
E-BOOK
194. Electrical conductive adhesives with nanotechnologies
Author: Yi Li, Daniel Lu, C.P. Wong.
Library: Vali Asr University Central Library (Kerman)
Subject: Electronic packaging,Solder and soldering,Adhesives,Nanostructured materials
Classification :
TK
7870
.
15
.
L49
2010
195. Electrical conductive adhesives with nanotechnologies
Author:
Library: Central Library and Documents Center of Mazandaran University (Mazandaran)
Subject: Electronic packaging. ; Solder and soldering. ; Adhesives ; Electric properties. ; Nanostructured materials. ;
196. Electrical conductive adhesives with nanotechnologies
Author: / C.P. Wong, Y. Li, D. Lu
Library: Campus International Library of Kish University of Tehran (Hormozgan)
Subject: Electronic packaging,Solder and soldering,Adhesives -- Electric properties,Nanostructured materials
Classification :
TK
7870
.
15
.
W6
2010
197. Electrical conductive adhesives with nanotechnologies
پدیدآورنده : Yi Li, Daniel Lu, C.P. Wong
موضوع : Electronic packaging,Solder and soldering,Adhesives, Electric properties,Nanostructured materials
۲ نسخه از این کتاب در ۲ کتابخانه موجود است.
198. Electrical conductive adhesives with nanotechnologies
Author: / Yi Li, Daniel Lu, C.P. Wong
Library: Central Library and Document Center of Shahid Chamran University (Khuzestan)
Subject: Electronic packaging.,Solder and soldering.,Adhesives--Electric properties,Nanostructured materials.
Classification :
TK
,
7870
.
15
,.
L49
,
2010
199. Electrically conductive adhesives /
Author: edited by R. Gomatam and K.L. Mittal
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Adhesion,Adhesives-- Environmental aspects,Electric conductivity,Solder and soldering-- Environmental aspects
Classification :
TP968
.
E44
2008
200. Epoxy adhesive formulations /
Author: Edward M. Petrie.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Adhesives-- Formability.,Epoxy coatings-- Formability.,Epoxy compounds-- Formability.,Epoxy resins-- Formability.,Adhésifs.,Époxydes.,Formulation (génie chimique)
Classification :
TP1180
.
E6
P48
2006
