1. Advanced MEMS packaging
Author: John H. Lau ... ]et al.[
Library: (Semnan)
Subject: ، Microelectromechanical systems,، Microelectronic packaging
Classification :
TK
7875
.
A378
2010
2. Advanced MEMS packaging
Author: John H. Lau ... [et al.]&
Library: Library of Urmia University of Technology (West Azarbaijan)
Subject: Microelectromechanical systems,Microelectronic packaging
Classification :
TK
,
7875
,.
A378
,
2010
3. Advanced MEMS packaging
Author: John H. Lau [and others].
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Microelectromechanical systems.,Microelectronic packaging.,TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
Classification :
TK7875
.
J646
2010
4. Advanced MEMS packaging
Author: / John H. Lau ... [et al.]
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: ELECTRONIC|ENGINEERING, MECHANICAL|ENGINEERING, TELECOMMUNICATIONS&ENGINEERING, ELECTRICAL
Classification :
E-BOOK
5. Fan-out wafer-level packaging /
Author: John H. Lau.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Chip scale packaging.,Circuits and Systems.,Engineering.,Nanotechnology and Microengineering.,Optical and Electronic Materials.,Chip scale packaging.,TECHNOLOGY & ENGINEERING-- Mechanical.
Classification :
TK7870
.
17
6. Flip chip technologies
Author: John H. Lau; editor
Library: Central Library and Documents Center of Industrial University of Khaje Nasiredin Toosi (Tehran)
Subject: ، Microelectronic packaging,، Multichip modules )Microelectronics(- Design and construction
Classification :
TK
7874
.
F5897
7. Handbook of tape automated bonding
Author: / edited by John H. Lau
Library: Central Library and Documents Center of Tehran University (Tehran)
Subject: Electronic Packaging
Classification :
TK
7870
.
15
.
H37
1992
8. Heterogeneous integrations /
Author: John H. Lau.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Integrated circuits.,Integrated circuits.
Classification :
TK7874
9. Low cost flip chip technologies: for DCA, WLCSP, and PBGA assemblies
Author: / John H. Lau
Library: National Library and Archives of Islamic Republic of Iran (Tehran)
Subject: میکروالکترونیک,بستهبندی میکروالکترونیکی
Classification :
TK
۷۸۷۴
/
ل
۲
ل
۹ ۱۳۷۹
10. Microvias: for low -cost, high-density interconnects
Author: / John H. Lau, S.W. Ricky Lee
Library: National Library and Archives of Islamic Republic of Iran (Tehran)
Subject: نصب تجهیزات میکروالکترونی,مدارهای مجتمع -- ةرح و ساختمان -- کنترل هزینه,نیمه هادیها -- پیوند,مدارهای چاپی
Classification :
TK
۷۸۷۴
/
ل
۲
م
۲۹ ۱۳۸۰
11. Reliability of RoHS-Compliant 2D and 3D IC interconnects
Author: Lau, John H.
Library: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
Subject: Reliability ، Interconnects )Integrated circuit technology(,Reliability ، Green technology
Classification :
TK
7874
.
53
.
L38
2011
12. Solder joint reliability
Author: / edited by John H. Lau
Library: Library of Campus2 Colleges of Engineering of Tehran University (Tehran)
Subject: Welded joints,Solder and soldering
Classification :
TA
492
.
W4S63
1991
13. Solder joint reliability
Author: / edited by John H. Lau
Library: Tehran University, technical faculty libraries 1 (Tehran)
Subject: Welded joints,Solder and soldering
Classification :
TA
492
.
W4S63
1991
14. Solder joint reliability
Author: / edited by John H. Lau
Library: Central Library and Documents Center of Tehran University (Tehran)
Subject: Welded joints,Solder and soldering
Classification :
TA
492
.
W4S63
1991
