1. Solder paste in electronics packaging
Author: / Jennie S.Hwang,Hwang
Library: Central Library and Documents Center of Tehran University (Tehran)
Subject: Printed circuits -- Design and construction,Solder pastes,surfacemount technology
Classification :
TK
7868
.
P7H82
1989
2. Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly
Author: Hwang, Jennie S.
Library: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
Subject: Design and construction ، Printed circuits,، Solder pastes,، Surface mount technology
Classification :
TK
7868
.
P7
H82
1989
3. Solder paste in electronics packaging :technology and applications in surface mount, hybrid circuits, and component assembly
Author: Jennie S. Hwang
Library: Central Library and Information Center of Shahed University (Tehran)
Subject: Printed circuits--Design and construction,Solder pastes,Surface mount technology
Classification :
TK
،
7868
،.
P7
,
H82
،
1989
