عنوان
پدید آورنده
موضوع
رده
TK7870.17 .A38 2019
TK7870
.
17
.
A38
2019
کتابخانه
محل استقرار
INTERNATIONAL STANDARD BOOK NUMBER
(Number (ISBN
9781119313984 (ePub)
(Number (ISBN
9781119313977 (Adobe PDF)
(Number (ISBN
9781119314134 (hardcover)
NATIONAL BIBLIOGRAPHY NUMBER
Number
1526812
LANGUAGE OF THE ITEM
.Language of Text, Soundtrack etc
انگلیسی
TITLE AND STATEMENT OF RESPONSIBILITY
Title Proper
Advances in embedded and fan-out wafer level packaging technologies /
First Statement of Responsibility
[edited by] Beth Keser, Steffen Kroehnert.
EDITION STATEMENT
Edition Statement
1st edition.
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Hoboken, NJ :
Name of Publisher, Distributor, etc.
Wiley,
Date of Publication, Distribution, etc.
2019
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
1 online resource.
INTERNAL BIBLIOGRAPHIES/INDEXES NOTE
Text of Note
Includes bibliographical references and index.
TOPICAL NAME USED AS SUBJECT
Entry Element
Chip scale packaging.
Entry Element
Integrated circuits
Topical Subdivision
Wafer scale integration.
DEWEY DECIMAL CLASSIFICATION
Edition
23
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK7870
.
17
Book number
.
A38
2019
PERSONAL NAME - SECONDARY RESPONSIBILITY
Entry Element
Keser, Beth,
Entry Element
Kroehnert, Steffen,
Dates
1971-
Dates
1970-
ORIGINATING SOURCE
Country
Iran
Agency
University of Tehran. Library of College of Engineering (Number 2)
Date of Transaction
20220209174304.0
Cataloguing Rules (Descriptive Conventions))
rda
BL
270410
Y
