:manufacturing trends in electronics interconnection technology
First Statement of Responsibility
/ Committee on Manufacturing Trends in Printed Circuit Technology, Board on Manufacturing and Engineering Design, Division on Engineering and Physical Sciences, National Research Council of The National Academies
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Washington, D.C.
Name of Publisher, Distributor, etc.
: National Academies Press,
Date of Publication, Distribution, etc.
, c2005.
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
xi, 81 p.
Other Physical Details
: ill.
NOTES PERTAINING TO PUBLICATION, DISTRIBUTION, ETC.
Text of Note
e
INTERNAL BIBLIOGRAPHIES/INDEXES NOTE
Text of Note
Includes bibliographical references.
OTHER VARIANT TITLES
Variant Title
Manufacturing trends in electronics interconnection technology