[edited by] Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech.
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Hoboken, NJ :
Name of Publisher, Distributor, etc.
Wiley ,
Date of Publication, Distribution, etc.
2012.
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
xxvi, 579 p.
INTERNAL BIBLIOGRAPHIES/INDEXES NOTE
Text of Note
Includes bibliographical references and index.
SUMMARY OR ABSTRACT
Text of Note
"This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"--
TOPICAL NAME USED AS SUBJECT
Interconnects (Integrated circuit technology)
Integrated circuits-- Ultra large scale integration.