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عنوان
Wire bonding in microelectronics
پدید آورنده
/ George G. Harman
موضوع
Wire bonding (Electronic packaging),Electronic packaging,Electronic packaging,Semiconductors,-- Production control,-- Reliability,-- Defects,-- Failures
رده
621
.
381046
H287W
2010
کتابخانه
Central Library and Archive Center of shahid Beheshti University
محل استقرار
استان:
Tehran
ـ شهر:
Tehran
تماس با کتابخانه :
22431916
-
021
NATIONAL BIBLIOGRAPHY NUMBER
Number
275813
LANGUAGE OF THE ITEM
.Language of Text, Soundtrack etc
انگلیسی
COUNTRY OF PUBLICATION OR PRODUCTlON
Country of publication
IR
TITLE AND STATEMENT OF RESPONSIBILITY
Title Proper
Wire bonding in microelectronics
General Material Designation
[book]
First Statement of Responsibility
/ George G. Harman
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
New York
Name of Publisher, Distributor, etc.
: McGraw-Hill
Date of Publication, Distribution, etc.
، 2010
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
xx, 426 p.
Other Physical Details
: ill. + 1 CD-ROM
SERIES
Series Title
Reliability and yield problems of wire bonding in microelectronics
GENERAL NOTES
Text of Note
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989
TOPICAL NAME USED AS SUBJECT
Entry Element
Wire bonding (Electronic packaging)
Entry Element
Electronic packaging
Entry Element
Electronic packaging
Entry Element
Semiconductors
Topical Subdivision
-- Production control
Topical Subdivision
-- Reliability
Topical Subdivision
-- Defects
Topical Subdivision
-- Failures
DEWEY DECIMAL CLASSIFICATION
Number
621
.
381046
H287W
2010
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK7836
.
H366
2010
PERSONAL NAME - ALTERNATIVE RESPONSIBILITY
Entry Element
Harman, George G
Entry Element
Harman, George G.
Relator Code
creator
Relator Code
author
ORIGINATING SOURCE
Country
ایران
LOCATION AND CALL NUMBER
Call Number
TK7836 .H366 2010
Previous cataloging
BL
1
Y
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