INTERNATIONAL STANDARD BOOK NUMBER
(Number (ISBN
9781439862056 (hardback)
NATIONAL BIBLIOGRAPHY NUMBER
Country Code
IR
Number
E-8180
LANGUAGE OF THE ITEM
.Language of Text, Soundtrack etc
انگلیسی
COUNTRY OF PUBLICATION OR PRODUCTlON
Country of publication
IR
TITLE AND STATEMENT OF RESPONSIBILITY
Title Proper
Semiconductor packaging
General Material Designation
[Book]
Other Title Information
:materials interaction and reliability
First Statement of Responsibility
/ Andrea Chen, Randy Hsiao-Yu Lo
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
Boca Raton, FL
Name of Publisher, Distributor, etc.
: CRC Press,
Date of Publication, Distribution, etc.
, 2011.
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
xviii, 198 p.
Other Physical Details
: ill.
Dimensions
; 24 cm.
NOTES PERTAINING TO PUBLICATION, DISTRIBUTION, ETC.
Text of Note
Print - Electronic
INTERNAL BIBLIOGRAPHIES/INDEXES NOTE
Text of Note
Includes bibliographical references and index.
CONTENTS NOTE
Text of Note
"Preface Semiconductor packaging assembly and test is an important manufacturing step necessary to create electronic products. The subject is not understood in much depth, as compared to a subject like circuit design. It is generally believed that this is due to the nature of the topic, as back-end processing of semiconductors is a multidisciplinary area, encompassing materials science, mechanical design, electrical layout and modeling, and many other engineering specialties. This book specifically addresses that shortcoming, especially in the area of materials used for packaging semiconductors and their interactions. Simply put, semiconductor packages are not monolithic entities but are made up of many different components interlocked with the common goal of protecting the integrated circuit while allowing it to communicate with the outside world--the lead frame or substrate on which the chip sits upon, the die attach adhesive to glue the chip down, electrical connections made via metallic bonding wires or bond pad bumps for flip chip attachment, and finally an epoxy molding compound to encapsulate everything for protection. And, those components are made up of very different materials: polymers, composites, metals, and various combinations of those categories. Understanding how the various materials behave and interact as they form the protective barrier for the delicate chip is key for making the package reliable and robust. To gain these insights, a basic knowledge of material properties is necessary, along with determining which behaviors are important to package performance. That takes understanding how a given property is measured and why it is significant"--Provided by publisher.
Text of Note
"In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world"--Provided by publisher.
TOPICAL NAME USED AS SUBJECT
Microelectronic packaging.
DEWEY DECIMAL CLASSIFICATION
Number
621
.
3815
.
2
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK7870
.
15
Book number
.
C54
2011
PERSONAL NAME - PRIMARY RESPONSIBILITY
Chen, Andrea
PERSONAL NAME - SECONDARY RESPONSIBILITY
Lo, Randy
ORIGINATING SOURCE
Country
ایران
ELECTRONIC LOCATION AND ACCESS
Host name
Semiconductor Packaging: Materials Interaction and Reliability /
Access number
عادی
Compression information
عادی
Electronic name
E-8180.pdf
Bits per second
0
Contact for access assistance
ایمانی
Electronic Format Type
متن
File size
0
Record control number
E-8180
Public note
انگلیسی
old catalog
pe
BL
1
a
Y
