Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture : Effects of Temperature, Moisture and Mechanical Driving Forces
General Material Designation
[Book]
First Statement of Responsibility
/ W.
Subsequent Statement of Responsibility
; Mai, Y.-Wong, E
.PUBLICATION, DISTRIBUTION, ETC
Name of Publisher, Distributor, etc.
Elsevier Science
Date of Publication, Distribution, etc.
, 2015.
NOTES PERTAINING TO PUBLICATION, DISTRIBUTION, ETC.
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture : Effects of Temperature, Moisture and Mechanical Driving Forces