Structural analysis in microelectronics and fiber optics, 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
New York
Name of Publisher, Distributor, etc.
American Society of Mechanical Engineers
Date of Publication, Distribution, etc.
1997
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
v, 272 p.: ill
SERIES
Series Title
EEP ; vol. 21
GENERAL NOTES
Text of Note
Includes bibliographies and author index
TOPICAL NAME USED AS SUBJECT
Entry Element
Microelectronic packaging - Congresses
Entry Element
Fiber optics - Congresses
Entry Element
Structural analysis )Engineering( - Congresses
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK
Book number
7874
Classification Record Number
.
S84527
1997
PERSONAL NAME - PRIMARY RESPONSIBILITY
Relator Code
TI
Entry Element
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir