Sensing, modeling and simulation in emerging electronic packaging: presented at the 1996 ASME International Mechanical Engineering Congress and Exposition , November 17-22, 1996, Atlanta, Georgia
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
New York
Name of Publisher, Distributor, etc.
American Society of Mechanical Engineering
Date of Publication, Distribution, etc.
1996
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
v, 125 p.: ill
SERIES
Series Title
FED; Vol. 17
GENERAL NOTES
Text of Note
Includes bibliographies and index
TOPICAL NAME USED AS SUBJECT
Entry Element
Electronic Packaging - Congresses
Entry Element
Multichip modules )Microelectronics( - Congresses
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK
Book number
7870
.
15
Classification Record Number
.
A852
1996
PERSONAL NAME - PRIMARY RESPONSIBILITY
Relator Code
AU
Entry Element
sponsored by the Elctrical and Electronic Packaging Division, ASME ; edited by Chao-Pin Yeh, Charled Ume
CORPORATE BODY NAME - SECONDARY RESPONSIBILITY
Entry Element
ASME International Mechanical Engineering Congress and Exposition )1996: Atlanta, Georgia(