Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack 95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Luhaina, Maui, Hawaii
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
New York
Name of Publisher, Distributor, etc.
American Society of Mechanical Engineers
Date of Publication, Distribution, etc.
1995
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
2 v. : ill
SERIES
Series Title
EEP, vol. 10-1,2
GENERAL NOTES
Text of Note
Includes bibliographical references and indexes
TOPICAL NAME USED AS SUBJECT
Entry Element
Electronic packaging - Congresses
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK
Book number
7870
.
15
Classification Record Number
.
I57
1995
PERSONAL NAME - PRIMARY RESPONSIBILITY
Relator Code
AU
Entry Element
Sponsored by the Electrical and Electronic packaging Division, ASME, The Japan Society of Mechanical Engineers; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama
CORPORATE BODY NAME - SECONDARY RESPONSIBILITY
Entry Element
International Intersociety Electronic Packaging Conference )1995 : Lahaina, Maui, Hawaii(