Application of fracture mechanics in electronic packaging and materials : presented at the International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, Claifornia
.PUBLICATION, DISTRIBUTION, ETC
Place of Publication, Distribution, etc.
New York
Name of Publisher, Distributor, etc.
American Society of Mechanical Engineers
Date of Publication, Distribution, etc.
1995
PHYSICAL DESCRIPTION
Specific Material Designation and Extent of Item
vi, 271 p. : ill
SERIES
Series Title
MD ; Vol. 64
GENERAL NOTES
Text of Note
Includes bibliographies
TOPICAL NAME USED AS SUBJECT
Entry Element
Electronic packaging - Materials - Congresses
Entry Element
Materials - Electric properties - Congresses
LIBRARY OF CONGRESS CLASSIFICATION
Class number
TK
Book number
7870
.
15
Classification Record Number
.
A85
1995
PERSONAL NAME - PRIMARY RESPONSIBILITY
Relator Code
AU
Entry Element
sponsored by the electrical and Electronic Packaging Division, ASME, The Materials Division, ASME ; edited by Tien Y. Wu ... ]et al.[
CORPORATE BODY NAME - SECONDARY RESPONSIBILITY
Entry Element
ASME International Mechanical Engineering Congress and Exposition )1995 : San Francisco, California(