عنوان

Microjoining and nanojoining /

(Number (ISBN

1615831843

(Number (ISBN

1845691792

(Number (ISBN

184569404X

(Number (ISBN

9781615831845

(Number (ISBN

9781845691790

(Number (ISBN

9781845694043

Erroneous ISBN

1420070835

Erroneous ISBN

9781420070835

Number

b744845

Title Proper

Microjoining and nanojoining /

General Material Designation

[Book]

First Statement of Responsibility

edited by Y. Zhou.

Place of Publication, Distribution, etc.

Boca Raton :

Name of Publisher, Distributor, etc.

CRC Press,

Date of Publication, Distribution, etc.

2008.

Specific Material Designation and Extent of Item

1 online resource (xxiv, 810 pages) :

Other Physical Details

illustrations.

Series Title

Woodhead Publishing in materials

Text of Note

Includes bibliographical references and index.

Text of Note

Introduction -- Basics of microjoining: Mechanisms of solid-state bonding processes / J.E. Gould. Mechanisms of soldering and brazing / T. Takemoto. Fundamentals of fusion microwelding / G.A. Knorovsky. Modeling of solid state bonding / Y. Takahashi. Modeling of fusion microwelding / B.H. Chang. Sensing, monitoring and control / M. Mayer. Assembly process automation and materials handling / Y.M. Cheung, D. Liu -- Microjoining and nanojoining processes: Microelectronics wire bonding / I. Lum, M. Mayer, Y. Zhou. Solid-state diffusion bonding / A. Shirzadi. Bonding using nanoparticles / A. Hirose. Diffusion soldering and brazing / M.L. Kuntz, Y. Zhou -- Laser Soldering / Y.H. Tian, C.Q. Wang -- Fluxless soldering / J.P. Jung -- Laser microwelding / I. Mityamoto. Electron beam microwelding / G.A. Knorovsky. Resistance microwelding / S. Fukumoto. Adhesive bonding / S. Bohm, G. Hemken, M. Wagner. Introduction to nanojoining / S. Sahin -- Microjoining of materials and applications of microjoining: Joining of high temperature superconductors / G. Zou. Joining of shape memory alloys / K. Uenishi, K.F. Kobayashi. Wafer bonding / J. Wei, Z. Sun. Plastics microwelding / I. Jones. Microjoining in medical components and devices / K.J. Ely, Y. Zhou. Hermetic sealing of solid oxide fuel cells / M. Brochu. Joining of bulk nanostructured materials / M. Brochu. Ceramic/metal bonding / A Wu.

0

Text of Note

Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells. This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. Reviews the basics of nanojoining including solid-state bonding and fusion microweldingCovers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modellingExamines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells.

Text of Note

Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002.

Source for Acquisition/Subscription Address

Knovel Corporation

Title

Microjoining and nanojoining.

International Standard Book Number

9781845691790

Joints (Engineering)

Metal bonding.

Microelectromechanical systems-- Design and construction.

Microelectronics.

Microtechnology.

Nanoelectromechanical systems-- Design and construction.

Nanoelectronics.

Nanotechnology.

Sealing (Technology)

Festkörper.

Joints (Engineering)

Metal bonding.

Microelectromechanical systems-- Design and construction.

Microelectronics.

Microtechnology.

Mikroelektronik.

Nanoelectronics.

Nanoelektronik.

Nanostrukturiertes Material.

Nanotechnology.

Sealing (Technology)

TECHNOLOGY & ENGINEERING-- Technical & Manufacturing Industries & Trades.

Verbindungstechnik.

TEC-- 040000

Number

Edition

Class number

Book number

Class number

Class number

System Code

System Code

Zhou, Y.

Institute of Materials, Minerals, and Mining.

Date of Transaction

20201204051459.0

Cataloguing Rules (Descriptive Conventions))

pn

Electronic name

[Book]

Y