Development and fabrication of IC chips -- Plastics, elastomers, and composites -- Ceramics and glasses -- Metals -- Solder technologies for electronic packaging and assembly -- Electroplating and deposited metallic coatings -- Printed circuit board fabrication -- Materials and processes for hybrid microelectronics and multichip modules -- Adhesives, underfills, and coatings in electronics assemblies -- Thermal management materials and systems.
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SUMMARY OR ABSTRACT
Text of Note
"Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today's cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design."
ACQUISITION INFORMATION NOTE
Source for Acquisition/Subscription Address
Knovel Corporation
OTHER EDITION IN ANOTHER MEDIUM
Title
Electronic materials and processes handbook.
International Standard Book Number
0071402144
TOPICAL NAME USED AS SUBJECT
Electronic apparatus and appliances-- Materials, Handbooks, manuals, etc.