عنوان

Copper interconnect technology /

(Number (ISBN

1441900764

(Number (ISBN

9781441900760

Erroneous ISBN

1441900756

Erroneous ISBN

9781441900753

Number

b706333

Title Proper

Copper interconnect technology /

General Material Designation

[Book]

First Statement of Responsibility

Tapan Gupta.

Place of Publication, Distribution, etc.

New York :

Name of Publisher, Distributor, etc.

Springer,

Date of Publication, Distribution, etc.

©2009.

Specific Material Designation and Extent of Item

1 online resource (xix, 423 pages) :

Other Physical Details

illustrations

Text of Note

Includes bibliographical references and index.

Text of Note

Dielectric Materials -- Diffusion and Barrier Layers -- Pattern Generation -- Deposition Technologies of Materials for Cu-Interconnects -- The Copper Damascene Process and Chemical Mechanical Polishing -- Conduction and Electromigration -- Routing and Reliability.

0

Text of Note

Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials now prevails in the international microelectronics industry. However, as the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.

Source for Acquisition/Subscription Address

Springer

Stock Number

978-1-4419-0075-3

Title

Copper interconnect technology.

International Standard Book Number

1441900756

Copper.

Interconnects (Integrated circuit technology)

Microelectronics.

Copper.

Copper.

Ingénierie.

Interconnects (Integrated circuit technology)

Interconnects (Integrated circuit technology)

Microelectronics.

Microelectronics.

TECHNOLOGY & ENGINEERING-- Electronics-- Semiconductors.

TECHNOLOGY & ENGINEERING-- Electronics-- Solid State.

TEC-- 008090

TEC-- 008100

TJF

Number

Edition

Class number

Book number

Class number

System Code

Gupta, Tapan.

Date of Transaction

20201207213525.0

Cataloguing Rules (Descriptive Conventions))

pn

Electronic name

[Book]

Y