عنوان

Simulation and experiments of material-oriented ultra-precision machining /

(Number (ISBN

9789811333354

(Number (ISBN

9789811333361

(Number (ISBN

9811333351

(Number (ISBN

981133336X

Erroneous ISBN

9789811333347

Erroneous ISBN

9811333343

Title Proper

Simulation and experiments of material-oriented ultra-precision machining /

General Material Designation

[Book]

First Statement of Responsibility

Junjie Zhang, Bing Guo, Jianguo Zhang, editors.

Place of Publication, Distribution, etc.

Singapore :

Name of Publisher, Distributor, etc.

Springer,

Date of Publication, Distribution, etc.

[2019]

Specific Material Designation and Extent of Item

1 online resource (310 pages)

Series Title

Springer Tracts in Mechanical Engineering

Text of Note

Intro; Contents; Fundamentals of Nanometric Cutting of Nanotwinned Copper; 1 Introduction; 2 Simulation Method; 3 Results and Discussion; 3.1 Nanometric Cutting Mechanisms of NT Cu; 3.2 Effect of Rake Angle; 3.3 Effect of Inclination Angle; 3.4 Effect of TB Spacing; 3.5 Effect of Grain Size; 4 Summary; References; Investigation into Plastic Deformation and Machining-Induced Subsurface Damage of High-Entropy Alloys; 1 Introduction; 2 Models and Methods; 2.1 Building Model; 2.2 Simulation Method; 3 Plastic Deformation Behavior; 3.1 Single-Crystal High-Entropy Alloy

Text of Note

2 Material Removal Rate and Surface Roughness in Polishing Anisotropic Monocrystalline Materials for Optoelectronics2.1 Removal Rate in Polishing Monocrystalline Materials; 2.2 Polishing of Crystal Planes with Different Crystallographic Orientation; 2.3 Polished Surface Roughness of Optoelectronic Components Made of Monocrystalline Materials; 3 Mechanical Polishing Optoelectronic Components of Crystal Materials; 4 Surface Roughness of Optoelectronic Components in Mechanical Polishing; 5 Conclusions; References

Text of Note

3.2 Nanocrystalline High-Entropy Alloy4 Machining-Induced Subsurface Damage; 4.1 Indentation of High-Entropy Alloy; 4.2 Scratching of High-Entropy Alloy; 5 Conclusions; References; Investigation into the Realization of a Single Atomic Layer Removal in Nanoscale Mechanical Machining of Single Crystalline Copper; 1 Introduction; 2 Simulation Models and Methods; 3 Effect of Machining Parameters on Material Removal Process; 4 Effect of Crystal Orientation and Scratching Direction on the Material Removal Process; 5 Conclusions; References

Text of Note

Cutting Mechanism and Surface Formation of Ultra-Precision Raster Fly Cutting1 Introduction; 2 Material Removal Mechanism of UPRFC; 2.1 Material Removal Mechanism and Cutting Distance Calculation; 2.2 Chip Formation in UPRFC; 3 Surface Microwaves in UPRFC; 4 Tool Wear Features and Their Effects on Surface Integrity; 4.1 Tool Wear Characteristics and Their Effect on Cutting Chips; 4.2 Tool Wear Evaluation Using Cutting Chips; 5 Conclusion; References; Modeling and Experimental Study of Surfaces Optoelectronic Elements from Crystal Materials in Polishing; 1 Introduction

Text of Note

Thermally Assisted Microcutting of Calcium Fluoride Single Crystals1 Optics Fabrication Methods; 2 Machinability of Calcium Fluoride; 2.1 Slip Model; 2.2 Critical Undeformed Chip Thickness; 2.3 Surface Analysis; 2.4 Theoretical Modeling; 3 Analysis of Thermal Assistance; 3.1 Thermal Effects on Material Properties; 3.2 Heat-Assisted Machining Simulations; 4 Thermally Assisted Machining Technology; 4.1 Current State of Technology; 4.2 Laser-Assisted Machining; 4.3 Alternate Heating Methods; 4.4 Challenges in Hot Machining; References

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Text of Note

Ultra-precision machining is a promising solution for achieving excellent machined surface quality and sophisticated micro/nano-structures that influence the applications of components and devices. Further, given the ultrathin layer of material removed, it is a highly coupled process between cutting tool and material. In this book, scientists in the fields of mechanical engineering and materials science from China, Ukraine, Japan, Singapore present their latest research findings regarding the simulation and experiment of material-oriented ultra-precision machining. Covering various machining methods (cutting, grinding, polishing, ion beam and laser machining) and materials (metal, semiconductor and hard-brittle ceramics), it mainly focuses on the evaluation of the fundamental mechanisms and their implementation in processing optimization for different materials. It is of significant theoretical and practical value for guiding the fabrication of ultra-smooth and functional surfaces using ultra-precision machining.

Source for Acquisition/Subscription Address

Springer Nature

Stock Number

com.springer.onix.9789811333354

Title

Simulation and Experiments of Material-Oriented Ultra-Precision Machining.

International Standard Book Number

9789811333347

Micromachining.

Micromachining.

TEC020000

TGP

TGP

Number

Edition

Class number

Guo, Bing

Zhang, Jianguo

Zhang, Junjie

Date of Transaction

20200823234507.0

Cataloguing Rules (Descriptive Conventions))

pn

Electronic name

[Book]

Y